Cold Plate Cavity Layout for High-Flux Chip Cooling
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Solution Overview
Problem
Existing cooling systems for high-power density chips face inefficiencies due to reduced cooling efficiency and increased thermal flux, leading to elevated chip temperatures that degrade performance and reliability.
Innovation Solution
Integrated cooling assemblies with alternating upper and lower cavity dividers in a cold plate design that increase surface area and control coolant fluid properties and flow characteristics, enhancing heat transfer efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional cooling systems are used for high-power density chips, then the structure is simple, but the cooling efficiency is reduced and thermal flux increases leading to elevated chip temperatures
Solution Approach 1:
The cold plate is segmented into multiple cavities separated by cavity dividers, creating a multi-chamber structure that increases the surface area for heat transfer. This segmentation allows coolant to flow through multiple pathways, improving cooling efficiency and reducing thermal flux concentration.
Solution Approach 2:
The cavity dividers extend vertically through the cold plate thickness, adding a vertical dimension to the heat transfer surface area. This three-dimensional structure significantly increases the effective heat transfer area compared to conventional flat cold plates, enabling better thermal management.
2Area of stationary object
If the cold plate uses a simple flat structure, then the manufacturing is easy, but the surface area for heat transfer is limited
Solution Approach 1:
The cold plate is divided into multiple cavities by vertical dividers, transforming a simple flat structure into a complex multi-chamber structure with increased surface area for heat transfer.
Solution Approach 2:
Vertical cavity dividers are introduced into the cold plate structure, transitioning from a two-dimensional flat surface to a three-dimensional multi-cavity structure that maximizes heat transfer area within the available volume.
3Reliability
If coolant flow path is straight and unobstructed, then the flow resistance is low, but the heat transfer efficiency is reduced
Solution Approach 1:
The coolant flow path is segmented into multiple channels by cavity dividers, forcing the coolant to navigate through a more complex multi-path flow pattern that enhances heat transfer efficiency through increased turbulence and surface area contact.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design increases coolant chamber volume surface area by 56%, improving heat transfer efficiency and reducing thermal stress on semiconductor devices.
Implementation Method 1
a cold plate attached to the semiconductor device... increasing an internal surface area of a cold plate across which a coolant fluid flows... improving heat transfer efficiency
Data Source
AI summary
A device package comprising an integrated cooling assembly. The integrated cooling assembly comprises a semiconductor device and a cold plate attached to the semiconductor device. The cold plate comprises a top portion and a bottom portion horizontally adjacent to the top portion. The top portion comprises upper cavity dividers extending downwardly to define upper cavity volumes. The bottom portion comprises lower cavity dividers extending upwardly to define lower cavity volumes. The upper cavity dividers and the lower cavity dividers alternate across a horizontal length of the cold plate.