Cold Plate Condenser Layout for Fanless Electronic Cooling
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Solution Overview
Problem
Conventional heat sinks for electronic/computer products with aluminum extrusions and fans are inefficient, costly, and prone to fan failures, compromising cooling performance and practicality.
Innovation Solution
A liquid cooling heat dissipation device utilizing a coolant cold plate with flow channels, heating elements, and a condenser, employing the siphon principle and pressure differential to circulate coolant without the need for energy-consuming fans, enabling rapid heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If powerful fans are mounted on the fins to rapidly dissipate heat, then cooling efficiency is improved, but device complexity and energy consumption increase
Solution Approach 1:
The patent extracts and eliminates the fan component from the heat dissipation system, replacing active cooling with a passive liquid circulation system that uses natural convection and phase change to achieve cooling without mechanical moving parts
Solution Approach 2:
The system uses the heat itself to drive the cooling process - the heating elements heat the coolant which then naturally circulates through phase change and density differential, making the system self-driven without external energy input for circulation
2Temperature
If powerful fans are mounted on the fins to rapidly dissipate heat, then cooling efficiency is improved, but energy consumption increases
Solution Approach 1:
The system uses the heat itself to drive the cooling process - the heating elements heat the coolant which then naturally circulates through phase change and density differential, making the system self-driven without external energy input for circulation
Solution Approach 2:
The coolant undergoes phase transition from liquid to vapor and back to liquid, utilizing latent heat of vaporization and condensation to efficiently transfer heat without requiring energy-consuming fans
3Temperature
If fans are added to the heat sink, then cooling performance is improved, but reliability decreases due to fan failures
Solution Approach 1:
The patent extracts and eliminates the fan component from the heat dissipation system, replacing active cooling with a passive liquid circulation system that uses natural convection and phase change to achieve cooling without mechanical moving parts
Solution Approach 2:
The system uses the heat itself to drive the cooling process - the heating elements heat the coolant which then naturally circulates through phase change and density differential, making the system self-driven without external energy input for circulation
4Area of stationary object
If conventional aluminum extrusions with fins are used, then heat dissipation area is enlarged, but cooling efficiency remains poor
Solution Approach 1:
The patent introduces a liquid coolant circulation system with flow channels that directly contact the heating elements, using fluid dynamics and phase change to enhance heat transfer efficiency far beyond what static air-cooled fins can achieve
Solution Approach 2:
The coolant undergoes phase transition from liquid to vapor and back to liquid, utilizing latent heat of vaporization and condensation to efficiently transfer heat without requiring energy-consuming fans
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances cooling efficiency, reduces costs, and eliminates fan-related failures by utilizing the siphon effect and pressure differential for coolant circulation, promoting rapid heat dissipation.
Implementation Method 1
heat the coolant in the flow channels, causing the low-temperature liquid coolant to absorb heat and vaporize
Implementation Method 2
The vaporized coolant rises through the tubes to the condenser where it is cooled back to liquid form
Implementation Method 3
Utilizing the siphon principle and generating a pressure differential, the coolant then circulates downward through the opposing tubes
Implementation Method 4
Utilizing the siphon principle and generating a pressure differential, the coolant then circulates downward through the opposing tubes
Implementation Method 5
the coolant in the flow channels, causing the low-temperature liquid coolant to absorb heat and vaporize
Data Source
AI summary
A liquid cooling dissipation device for electronic/computer products includes a top cover with a coolant cold plate and two cooling brackets. The cold plate has at least two sets of flow channels for accommodating coolant and connects to multiple heating elements. It features inlets and outlets at both ends, all connected to the flow channels. Tubes with mounting brackets at the top end are installed at these points. A condenser, mounted on the mounting brackets and featuring side brackets, includes at least two cooling flow channels, multiple heat-conducting plates, and several heat dissipation fins. The cold plate consists of four laminated layers: a first-layer bottom plate, a second-layer composite plate, a third-layer metal plate, and a fourth-layer top plate. Heat from the heating elements vaporizes the coolant, which the condenser returns to liquid, circulating via siphon effect and pressure differential.