Cold Plate Cooling Assembly for Integrated Circuit Socket
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Solution Overview
Problem
The increasing heat density in computer data centers and servers necessitates more efficient cooling methods, as traditional air cooling systems become inefficient and power-intensive, and liquid cooling solutions complicate component maintenance.
Innovation Solution
A cooling assembly that integrates a cold plate with spring-loaded attachment to a mounting frame and heat spreader, allowing for sealed liquid cooling without disconnection of fluid lines, enabling efficient heat transfer and easy component replacement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If air cooling is used, then the system is simple to implement, but cooling efficiency is insufficient for high heat density
Solution Approach 1:
The patent transitions from air cooling to liquid cooling by introducing a cold plate with fluid passageways that circulate coolant. This hydraulic approach provides superior heat transfer efficiency for high-density computing systems while maintaining reasonable system complexity through standardized cold plate components.
2Productivity
If liquid cooling is used, then cooling efficiency improves, but component replacement becomes difficult due to sealed coolant lines
Solution Approach 1:
The cooling system is segmented into modular cold plate units, each with independent coolant connections. This allows individual components to be replaced by removing only the specific cold plate module without disrupting the entire coolant distribution system or requiring system shutdown.
Solution Approach 2:
The coolant connection system incorporates flexible hoses and quick-connect mechanisms that allow cold plates to be dynamically connected and disconnected. This dynamic connection approach maintains sealed liquid cooling efficiency while enabling easy component replacement during system maintenance.
3Temperature
If refrigeration systems are used to cool air below ambient temperature, then cooling capacity increases, but power consumption exceeds 50% of total data center power
Solution Approach 1:
The patent introduces liquid coolant as an intermediary heat transfer medium between the computer components and the cooling system. This liquid-to-liquid heat exchange eliminates the need for air-to-air refrigeration cycles, dramatically reducing power consumption while maintaining effective cooling capacity.
Solution Approach 2:
The patent replaces the mechanical refrigeration system (compressors, condensers, evaporators) with a passive liquid cooling system that uses conduction and convection for heat transfer. This substitution eliminates the energy-intensive mechanical compression process while achieving superior cooling efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively manages heat density while maintaining a sealed liquid cooling system, reducing power consumption and simplifying component maintenance by allowing continuous operation of the cooling fluid lines during IC insertion or replacement.
Implementation Method 1
cold plate with fluid passageways and a spring-loaded heat spreader to transfer heat from integrated circuits to a cooling fluid
Implementation Method 2
Liquids typically have a much higher heat carrying capacity than air
Data Source
AI summary
A cooling apparatus is disclosed. The cooling apparatus comprising a printed circuit (PC) board with an integrated circuit (IC) socket mounted onto the top side of the PC board. A mounting frame generally in the shape of a plate, with a first opening passing through the center of the plate, is mounted on the top side of the PC board with the IC socket located inside the first opening. A cold plate is attached to the mounting frame, the cold plate has an opening that passes through the cold plate. The opening in the cold plate is sized to allow an IC to be inserted into the IC socket through the opening. A fluid passageway is formed inside the cold plate. A fluid inlet port and a fluid outlet port are mounted on the cold plate and coupled to a first end and a second end of the fluid passageway, respectively. A heat spreader is removably attached to the top side of the cold plate wherein the bottom side of the heat spreader is configured to contact the top side of an IC when the IC is mounted in the IC socket.