Cold Plate Copper Fin Cooling for Lightweight Laser Diodes
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Solution Overview
Problem
Traditional laser diode systems for direct energy applications are heavily weighted due to extensive cooling systems, which lead to leakage issues and mechanical stress, limiting their deployment in lightweight and portable platforms.
Innovation Solution
A laser diode system with a cold plate featuring copper fin cavities and an interior cavity for circulating a cooling medium, eliminating internal water connections and reducing system pressure, utilizing copper fins to efficiently dissipate heat without the need for internal water channels.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional water channel cooling systems are used in laser diodes, then effective heat dissipation is achieved, but system weight increases significantly and water leakage risks occur
Solution Approach 1:
The patent removes internal water channels from the laser diode structure, extracting the cooling function to an external cold plate system. This eliminates the need for internal water connections that cause leakage and reduce weight, while maintaining effective heat dissipation through external copper fins and cold plate contact.
2Temperature
If extensive water connections are installed for cooling, then heat dissipation is improved, but system reliability decreases due to leakage issues
Solution Approach 1:
By extracting water connections from the internal laser diode structure to an external cold plate system, the patent eliminates multiple internal water connection points that are prone to leakage. The external cold plate with copper fins provides reliable heat dissipation without compromising system reliability.
3Temperature
If traditional cooling systems with internal water channels are used, then heat dissipation is achieved, but device complexity increases
Solution Approach 1:
The patent simplifies the cooling system by removing internal water channels and connections from the laser diode structure. The cooling function is extracted to an external cold plate with copper fins, reducing device complexity while maintaining heat dissipation effectiveness.
Solution Approach 2:
The patent merges the cold plate with copper fins into a single integrated component, combining the heat transfer plate and heat dissipation fins. This consolidation reduces the number of separate parts and simplifies the overall cooling system structure.
4Temperature
If copper fins are embedded in cold plate cavities, then heat dissipation efficiency is improved, but manufacturing complexity increases
Solution Approach 1:
The patent embeds copper fins within cavities of the cold plate, creating a nested structure where the fins are housed inside the plate body. This nesting arrangement maximizes heat dissipation surface area within a compact volume while maintaining manufacturability through standardized cavity formation processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly reduces the overall weight and complexity of the cooling system, enhancing reliability and enabling the deployment of high-power laser diodes on various platforms with reduced flow and pressure requirements, while maintaining effective heat dissipation.
Implementation Method 1
a cooling medium is circulated through the interior cavity to cool the one or more laser diodes
Implementation Method 2
circulating, using a coolant pump, a cooling medium through a cold plate of the laser diode system to transfer waste heat from the one or more laser diodes to an outside environment
Implementation Method 3
a plurality of copper fins are coupled to the one or more laser diodes; wherein the plurality of copper fins are embedded within the plurality of copper fin cavities
Data Source
AI summary
A laser diode system is provided. The laser diode system comprises one or more laser diodes; a plurality of copper fins coupled to the laser diodes; and a cold plate comprising a plurality of copper fin cavities and an interior cavity. The plurality of copper fins are embedded within the plurality of copper fin cavities. A cooling medium is circulated through the interior cavity to cool the one or more laser diodes.