Embedded Cold Plate Assembly for Low-Resistance Chip Cooling
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Solution Overview
Problem
Current cooling systems for microelectronic devices face inefficiencies due to high thermal resistance at the interface between the chip and heat dissipation devices, leading to reduced cooling efficiency and increased energy consumption, especially as chip power density increases.
Innovation Solution
An embedded cooling assembly is directly attached to the microelectronic device using a cold plate body and a manifold lid, which forms a flow path without intervening thermal interface materials, utilizing direct dielectric or hybrid dielectric and metal bonds for improved heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If thermal interface materials are used to thermally couple the chip and heat dissipation devices, then the chip can be cooled, but the combined thermal resistance of the thermal interface materials and interfacial boundary regions inhibits heat transfer, reducing cooling efficiency
Solution Approach 1:
The patent removes the thermal interface material layer from the heat transfer path between the chip and heat dissipation device. By directly bonding the cold plate to the chip backside, the thermally resistive interface material is extracted from the system, eliminating the thermal resistance barrier while maintaining thermal coupling through direct dielectric or hybrid bonds.
Solution Approach 2:
The patent employs hybrid bonding interfaces that combine dielectric and metal bonds to achieve both electrical isolation and thermal conduction. This composite bonding approach allows direct thermal contact between the chip and cold plate while maintaining electrical separation, thereby improving heat transfer efficiency without compromising device functionality.
2Object-generated harmful factors
If conventional cooling systems with thermal interface materials are used, then heat dissipation is achieved, but the thermal resistance at interfacial boundaries reduces the overall cooling efficiency and increases energy consumption
Solution Approach 1:
The thermal interface material is removed from the system to eliminate the source of thermal resistance at the chip-cold plate interface. This extraction of the thermally resistive layer directly reduces the energy loss associated with heat transfer inefficiency while maintaining effective heat dissipation through direct bonding.
3Strength
If thermal interface materials are used to maintain thermal contact, then the chip and heat dissipation device remain coupled, but the thermal resistance at the interface reduces heat transfer effectiveness
Solution Approach 1:
The thermal interface material is extracted from the thermal contact path, replacing it with direct bonding between the chip and cold plate. This elimination of the interface material maintains strong thermal contact while removing the thermal resistance that degraded heat transfer effectiveness.
Solution Approach 2:
Hybrid bonding combining dielectric and metal bonds creates a composite interface that provides both mechanical strength for thermal contact and low thermal resistance for effective heat transfer, eliminating the need for separate thermal interface materials.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution significantly reduces thermal resistance, enhancing cooling efficiency and energy efficiency by eliminating the need for thermal interface materials, allowing for more effective heat dissipation and reduced energy consumption.
Implementation Method 1
one of the base plates is directly attached to the backside of the singulated device without an intervening adhesive... utilizing direct dielectric or hybrid dielectric and metal bonds for improved heat transfer
Implementation Method 2
the cold plate body and the manifold lid define one or more cavities that form a flow path between an inlet opening and an outlet opening disposed through the manifold lid
Data Source
AI summary
Embodiments herein provide for fluidic cooling assemblies embedded within a device package and related manufacturing methods. In one embodiment, the cooling assembly includes a cold plate body attached to a singulated device and a manifold lid attached to the cold plate body. The cold plate body has a first side adjacent to the singulated device and an opposite second side, and the manifold lid is attached to the second side. In some embodiments, the first side of the cold plate body and the backside of the singulated device each comprise a dielectric material surface, the cold plate body is attached to the singulated device by direct dielectric bonds formed between the dielectric material surfaces, the cold plate body, and the manifold lid define one or more cavities, and the one or more cavities form at least a portion of a fluid flow path from an inlet to an outlet of the manifold lid.