Cold Plate Diversion Groove Layout for Uniform Chip Cooling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing liquid coolers for chip processors suffer from disordered liquid flow, mixing of hot and cold liquids, and require a large cold plate with an integrated pump that complicates installation and maintenance.
Innovation Solution
A cold plate design with a diversion groove and cross-flow grooves ensures uniform liquid flow, eliminating turbulence and reducing the cold plate's volume by removing the, and relocating the pump to the radiator, allowing for easier installation and maintenance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the liquid pump is installed on the cold plate, then the cold plate can circulate liquid, but the cold plate becomes too large and difficult to install in narrow spaces
Solution Approach 1:
The liquid circulation system is segmented into two independent parts: the cold plate and the radiator. The pump is relocated from the cold plate to the radiator, allowing the cold plate to be compact and easily installable in narrow spaces while the radiator houses the pump mechanism.
Solution Approach 2:
The liquid pump is extracted from the cold plate and relocated to the radiator. This separation allows the cold plate to reduce its volume and simplify its structure, making it suitable for installation in confined spaces above processors.
2Temperature
If the cold plate has a complex internal structure with vapor chamber and through holes, then heat exchange can occur, but the flow of coolant to the heat exchange space is blocked
Solution Approach 1:
The internal structure is segmented into distinct functional zones: a liquid distribution groove for coolant flow, a heat exchange groove for thermal transfer, and a liquid collection groove for drainage. This segmentation eliminates the need for complex vapor chambers and through holes while maintaining effective cooling.
Solution Approach 2:
The complex vapor chamber structure with numerous through holes is extracted and replaced with a simplified groove-based system. The liquid distribution groove, heat exchange groove, and liquid collection groove work together to achieve effective cooling without blocking coolant flow.
3Reliability
If the cold plate has integrated pump and complex structure, then cooling function is achieved, but the entire cold plate must be removed for maintenance when pump fails
Solution Approach 1:
The system is segmented into modular components: the cold plate, the radiator, and the pump. The pump is integrated into the radiator rather than the cold plate, allowing independent maintenance of each component. When the pump fails, only the radiator needs to be accessed for repair, not the entire cold plate assembly.
Solution Approach 2:
The pump is extracted from the cold plate and relocated to the radiator. This extraction enables independent maintenance of the pump without requiring removal of the cold plate from the processor, significantly improving ease of repair while maintaining system reliability.
4Temperature
If cold liquid enters the cold plate directly, then cooling occurs, but the flow direction becomes disordered and hot and cold liquids mix together
Solution Approach 1:
The internal structure is segmented into functionally distinct grooves: the liquid distribution groove receives cold liquid and directs it along a defined path, the heat exchange groove facilitates thermal transfer, and the liquid collection groove collects the heated liquid. This segmentation ensures unidirectional flow and prevents mixing of hot and cold liquids while maintaining simple structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Uniform liquid flow and reduced cold plate size enhance cooling efficiency and ease of installation, with maintenance limited to the radiator when the pump fails.
Implementation Method 1
The cold plate is provided with a liquid pump, which is used to circulate the liquid between the cold and the liquid cooling radiator
Implementation Method 2
When the cold liquid enters the cold plate, it can cool the chip processor and heat up to become hot liquid
Implementation Method 3
The hot liquid then flows to the liquid cooling radiator to dissipate heat and become cold liquid
Data Source
AI summary
The present invention discloses a cold plate and a liquid cooler having the cold plate. The cold plate includes a cold plate body, an inlet and outlet liquid box and a heat conducting plate, which are used to form a liquid cooler with a liquid cooling radiator and two liquid pipes. The liquid cooling radiator can output a cooling liquid into a long diversion groove in the cold plate body. The diversion groove evenly guides the cooling liquid to a plurality of cross-flow grooves on a heat conducting plate for heat exchange and then flows from both ends of the cross-flow grooves to the long liquid outlet holes on both sides, thereby achieving the purpose of uniform heat dissipation and reducing the volume of the cold plate.