Stackable Cold Plate With Expanding Channels For Two-Phase Cooling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Two-phase liquid cooling systems for electronics face issues such as flow instabilities, pressure drop fluctuations, and dry-out conditions, leading to reduced performance and potential damage to electronic devices, along with inefficiencies in thermal management.
Innovation Solution
A cold plate device with a set of expanding channels that increase in height along the flow direction, stabilizing coolant fluid flow, reducing pressure drop, and improving thermal management by facilitating two-phase cooling through stackable layers and auxiliary channels for directed cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If two-phase liquid cooling systems are used for electronics, then cooling efficiency is improved, but flow instabilities occur causing fluctuating mass flux and pressure drop
Solution Approach 1:
The cooling system is divided into multiple independent channels, each with its own flow path. This segmentation allows better control over fluid distribution and reduces flow instabilities by preventing cross-interference between channels, while maintaining high cooling efficiency through optimized thermal contact with electronic components.
Solution Approach 2:
The channel geometry is designed with varying cross-sectional areas along the flow direction, creating dynamic flow conditions that stabilize two-phase flow. The expanding channel sections increase flow area to reduce pressure drop and prevent flow instabilities, while maintaining efficient heat transfer throughout the cooling system.
2Temperature
If cooling channels are designed to improve thermal management, then temperature distribution is improved, but pressure drop increases reducing flow efficiency
Solution Approach 1:
Different sections of the cooling channels have different cross-sectional areas optimized for their specific functions. Regions requiring enhanced cooling have smaller cross-sections for better thermal contact, while regions prone to high pressure drop have larger cross-sections to reduce flow resistance. This local optimization achieves uniform temperature distribution while minimizing overall pressure drop.
Solution Approach 2:
The channel design incorporates three-dimensional expanding sections that increase flow area in the vertical dimension while maintaining compact horizontal footprint. This dimensional approach allows sufficient flow area to reduce pressure drop without increasing the overall device size, while still providing effective thermal management through optimized channel geometry.
3Reliability
If channel height is increased to reduce pressure drop, then flow stability is improved, but device volume increases
Solution Approach 1:
The cooling channels are nested within the existing device structure, utilizing the thickness of the cold plate and integrating with the electronic component packaging. The expanding channel sections are positioned within the available vertical space without requiring additional external volume, achieving flow stabilization while maintaining compact device dimensions.
Solution Approach 2:
Channel expansion is achieved primarily in the vertical dimension within the cold plate thickness, rather than expanding horizontally. This allows increased channel height for flow stability while maintaining a compact device footprint, as the expansion utilizes the available vertical space within the existing device envelope.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the stability of coolant fluid flow, decreases pressure drop, improves thermal management, and increases energy efficiency of two-phase cooling systems, effectively maintaining electronic device temperatures within a desired range.
Implementation Method 1
stabilizing the coolant fluid flow and reducing pressure drop
Implementation Method 2
Two-phase liquid cooling systems for electronics
Implementation Method 3
two-phase cooling systems for electronics
Data Source
AI summary
Techniques that facilitate two-phase liquid cooling of an electronic device are provided. In one example, an apparatus, such as a cold plate device, comprises a first stackable layer and a second stackable layer. The first stackable layer comprises a first channel formed within the first stackable layer. The first channel comprises a first channel length and the first channel receives a coolant fluid via an inlet port of the apparatus. The second stackable layer comprises a second channel that provides a path for the coolant fluid to flow between the first channel and an outlet port of the apparatus. The second channel comprise a second channel length that is different than the first channel length.