Cold Plate Connection Channel Layout for Lower Flow Resistance

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Solution Overview

Problem

Conventional liquid cooling systems face challenges in maintaining cooling efficiency while reducing flow resistance without decreasing the heat exchange area, primarily due to the use of smaller pipes that increase flow resistance and reduce the heat exchange area.

Innovation Solution

A liquid cooling device design featuring a connection channel that extends from one end to another end of the cold plates and side cover, allowing for a larger width without reducing the size of the condenser or inner fins, thereby maintaining the heat exchange area and enhancing heat dissipation efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If smaller pipes are used to connect cold plates, then device complexity is reduced, but flow resistance increases and cooling efficiency deteriorates

Engineering Contradiction:
Improvepipe sizeVSAvoidflow resistance
Core Design Contradiction:
Device complexityVSLoss of energy

Solution Approach 1:

The connection channel transitions from a conventional small-diameter pipe to a large-width channel formed by the side cover, effectively changing the dimensional characteristics of the flow path. This dimensional change allows the channel to have much larger cross-sectional area while maintaining a compact overall structure, thereby reducing flow resistance without increasing device complexity

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The side cover acts as an intermediary component that creates the connection channel between cold plates. Instead of directly connecting cold plates with small pipes, the side cover mediates the connection by forming a large-width channel that reduces flow resistance while maintaining structural compactness

Inventive Principle:
Principle #24Intermediary (Mediator)

2Loss of energy

If condenser size is reduced to decrease flow resistance, then flow resistance decreases, but heat exchange area is reduced and cooling efficiency deteriorates

Engineering Contradiction:
Improveflow resistanceVSAvoidheat exchange area
Core Design Contradiction:
Loss of energyVSArea of stationary object

Solution Approach 1:

The connection channel uses a large width dimension rather than relying on increased pipe diameter or condenser size. This dimensional approach allows the flow path to have large cross-sectional area for reduced flow resistance while the condenser maintains its original size and heat exchange area

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Loss of energy

If pipe size is increased to decrease flow resistance, then flow resistance decreases, but device complexity and space requirements increase

Engineering Contradiction:
Improveflow resistanceVSAvoidoverall structure
Core Design Contradiction:
Loss of energyVSDevice complexity

Solution Approach 1:

The connection channel is merged with the side cover structure, combining the functions of structural support and fluid flow path into a single integrated component. This merging allows the channel to have large width for reduced flow resistance without adding separate large-diameter pipes that would increase device complexity

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design reduces flow resistance and pressure drop, improving heat dissipation efficiency by up to 53% and reducing the pressure drop of the coolant by 250.3 Pa, while maintaining the heat exchange area.

Implementation Method 1

the connection channel is in fluid communication with the first cold plate and the second cold plate, and the connection channel extends from one end of the first cold plate, the second cold plate and the side cover to another end

Methodology Applied
Scientific EffectFluid flow:

Implementation Method 2

High-performance electronic devices, in particular, are often provided with liquid cooling systems, such as water cooling plates, to provide better heat dissipation

Methodology Applied
Scientific EffectHeat exchange: Heat Exchanger

Implementation Method 3

The connection channel extends from one end to another end of the first cold plate, the second cold plate and the side cover, the connection channel can have larger width

Methodology Applied
Scientific EffectConvection: Convection

Data Source

PatentUS20250380378A1Liquid cooling device
Publication Date: 2025.12.11 INVENTEC PUDONG TECH CORPOARTION
  • US20250380378A1 patent drawing
  • US20250380378A1 patent drawing
  • US20250380378A1 patent drawing

AI summary

A liquid cooling device includes a first cold plate, a second cold plate and a side cover. The second cold plate is stacked on the first cold plate. The side cover is disposed on one side of the first cold plate and the second cold plate. In addition, the side cover and the one side of the first cold plate and the second cold plate together form a connection channel. The connection channel is in fluid communication with the first cold plate and the second cold plate, and the connection channel extends from one end of the first cold plate, the second cold plate and the side cover to another end of the first cold plate, the second cold plate and the side cover.