Cold Plate Removal Mechanism for Bonded GPU Modules

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Existing technologies face challenges in efficiently removing cold plates from graphics processing units (GPUs) due to the strong bonding force created by thermal interface materials, requiring significant manual effort and potential damage to the GPU.

Innovation Solution

A cold plate removal device with a main portion, arm portion, and pivot screw that applies leverage and torque to overcome the bonding force, allowing for easy detachment of the cold plate from the GPU.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If manual force is applied to remove the cold plate, then the bonding force can be overcome, but the GPU may be damaged and significant manual effort is required

Engineering Contradiction:

Improveease of cold plate removalVSAvoiddamage to GPU

Core Design Contradiction:

Ease of operationVSObject-affected harmful factors

Solution Approach 1:

The patent introduces a cold plate removal device as an intermediary tool between the operator and the cold plate-GPU assembly. This device includes a main portion, arm portion, and pivot screw that work together to apply controlled leverage force, eliminating the need for direct manual force on the GPU while safely overcoming the bonding force of the thermal interface material.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The removal device is segmented into distinct functional components: a main portion for structural support, an arm portion for applying leverage, and a pivot screw for controlled force application. This segmentation allows each component to perform its specific function efficiently, distributing the force application process across multiple specialized elements rather than requiring single-point manual force.

Inventive Principle:

Principle #1Segmentation

2Productivity

If significant manual effort is applied to overcome the bonding force, then the cold plate can be removed, but the process becomes complex and time-consuming

Engineering Contradiction:

Improveefficiency of cold plate removalVSAvoidcomplexity of removal process

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The removal device incorporates dynamic elements including the pivot screw mechanism that allows rotational motion to be converted into linear lifting force, and the arm portion that provides mechanical leverage. These dynamic components enable the device to adapt its force application during the removal process, making the operation more efficient while maintaining controlled complexity through well-defined mechanical movements.

Inventive Principle:

Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Facilitates safe and efficient removal of cold plates from GPUs by applying a controlled force, reducing the risk of damage and simplifying the process.

Implementation Method 1

The arm portion may extend from the main portion and provide a leverage force to the main portion

Methodology Applied

Scientific EffectMechanical Advantage: Mechanical Advantage

Implementation Method 2

The pivot screw may exert a force on the arm portion when the pivot screw is in the lower position

Methodology Applied

Scientific EffectTorque: Torque

Data Source

PatentUS12594654B2Cold plate removal device

Publication Date: 2026.04.07 DELL PROD LP

AI summary

A cold plate removal device includes a main portion, an arm portion, and a pivot screw. The arm portion extends from the main portion and provides a leverage force to the main portion. The pivot screw in physical communication with the arm portion. The pivot screw transitions between an upper position and lower position. The pivot screw exerts a force on the arm portion when the pivot screw is in the lower position and in physical communication with a graphics processing unit module.