Multi-Layer Cold Plate With Impingement Jets for Power Electronics
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Solution Overview
Problem
Conventional heat sinks are inadequate for effectively lowering the operating temperature of power electronics due to increased heat flux generated by advanced electrical systems.
Innovation Solution
A multi-layered cold plate assembly with an inlet manifold layer, target heat transfer layer, second-pass heat transfer layer, and outlet manifold layer, featuring impingement jet nozzles and serpentine channel walls to optimize coolant flow and enhance heat transfer, while maintaining low pressure drops.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If conventional heat sinks are used, then the structure is simple, but the heat flux removal capability is insufficient
Solution Approach 1:
The cold plate is divided into multiple layers including inlet manifold layer, target heat transfer layer, second-pass heat transfer layer, and outlet manifold layer. Each layer performs specific heat transfer functions, allowing the system to handle higher heat flux while maintaining manageable complexity through modular design
Solution Approach 2:
The invention transitions from conventional single-pass or simple channel heat sinks to a multi-layered three-dimensional structure with impingement jet nozzles directing coolant vertically onto heat transfer surfaces, then through radial microchannels. This dimensional approach significantly increases heat transfer area and effectiveness
2Power
If coolant flow rate is increased to remove more heat, then heat removal improves, but pressure drop increases
Solution Approach 1:
The coolant flow path is segmented into multiple passes through the target heat transfer layer and second-pass heat transfer layer. This segmentation allows heat removal to occur in stages, maintaining effective cooling while distributing pressure drop across multiple smaller pressure gradient sections rather than one large drop
Solution Approach 2:
Serpentine channel walls with curved geometries are used in the manifold layers to guide coolant flow. The curved paths reduce flow separation and turbulence losses compared to sharp corners, maintaining higher flow rates with lower pressure penalties
3Manufacturing precision
If uniform coolant flow is achieved at all inlet holes, then heat transfer uniformity improves, but manifold design complexity increases
Solution Approach 1:
The manifold design incorporates asymmetric features including non-uniform hole spacing and strategically positioned flow control elements. By intentionally creating asymmetric flow paths with different lengths and resistances, the design compensates for pressure drops to achieve uniform flow distribution across all inlet holes to the impingement jets
Solution Approach 2:
The manifold design adjusts geometric parameters such as hole diameters, spacing, and positions to optimize flow distribution. By varying these parameters across different locations in the manifold, uniform coolant flow is achieved at all inlet holes despite different path lengths and pressure drops
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively removes heat flux from power electronics by increasing the coolant's contact surface area and promoting fluid mixing, thereby achieving efficient cooling with reduced pressure drops and optimized fluid flow.
Implementation Method 1
Cooling fluid may be used to receive heat generated by the heat generating device by convective thermal transfer
Implementation Method 2
a jet of cooling fluid may be directed such that it impinges a surface of the heat generating device
Implementation Method 3
Heat generated by the power electronics device is transferred to the coolant fluid within the cold plate assembly at least through the substrate layer and the target heat transfer layer
Data Source
AI summary
A cold plate assembly includes an inlet manifold layer, a target heat transfer layer, a second-pass heat transfer layer, and an outlet manifold layer. The inlet manifold layer includes a coolant fluid outlet and an inlet channel. The inlet channel includes a plurality of fluid inlet holes fluidly coupled to a plurality of impingement jet nozzles. The target heat transfer layer includes a plurality of target heat transfer cells having a plurality of target heat transfer layer microchannels extending in a radial direction from a central impingement region. The second-pass heat transfer layer includes a plurality of second-pass heat transfer cells having a plurality of second-pass heat transfer layer microchannels extending in a radial direction toward a central fluid outlet region, and one or more transition channels. The impingement jet nozzles are positioned through the central fluid outlet region. The outlet manifold layer includes an outlet channel having a plurality of fluid outlet holes.