Cold Plate Lid Structure for High-Power Chip Cooling and Warp Control
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Solution Overview
Problem
High power semiconductor devices generate significant heat, requiring efficient cooling systems to maintain operating temperatures within optimal ranges, while existing solutions often suffer from thermal resistance and warping due to thermal expansion.
Innovation Solution
A cold plate lid with integrated fluid chambers, fins, and microchannels is designed to provide perpendicular fluid flow and minimize thermal resistance, incorporating microjets or nozzles for enhanced cooling and structural support to prevent warping.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a cold plate is attached to the chip, then heat transfer efficiency is improved, but thermal resistance increases due to multiple interface layers
Solution Approach 1:
The patent combines the cold plate with the package lid into a single integrated component. The cold plate lid directly contacts the semiconductor chip through the package substrate, eliminating intermediate thermal interfaces. This merging reduces thermal resistance by removing additional bonding layers and interface materials that would otherwise impede heat flow from the chip to the cooling fluid.
Solution Approach 2:
The package lid serves multiple functions: it provides mechanical support for the package, acts as a seal for the package interior, and functions as the cold plate for heat dissipation. This multi-functionality eliminates the need for a separate cold plate component, reducing the number of thermal interfaces and simplifying the thermal path from chip to cooling fluid.
2Power
If high power chips are used, then computing performance is improved, but warping occurs due to thermal expansion
Solution Approach 1:
The package lid and cold plate are designed with materials and structures that account for thermal expansion. The lid provides a rigid framework that constrains the semiconductor chip and package substrate, preventing warping caused by differential thermal expansion coefficients. The integrated design ensures uniform heat distribution and controlled expansion across the package components.
Solution Approach 2:
The cold plate lid is segmented into functional zones: a central region直接接触 the chip for heat extraction, peripheral regions for structural support and sealing, and integrated flow channels for cooling fluid distribution. This segmentation allows different portions to serve optimized functions while maintaining overall structural integrity under thermal stress.
3Temperature
If conventional cooling systems are used, then cooling is provided, but fluid flow control is insufficient for optimal heat dissipation
Solution Approach 1:
The cold plate lid incorporates integrated fluid channels and flow control features designed for liquid cooling. Cooling fluid flows through channels in the lid, maximizing heat transfer from the chip to the fluid. The hydraulic design optimizes flow distribution across the chip surface, ensuring uniform cooling and efficient heat removal.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design reduces thermal resistance and prevents warping, ensuring effective heat dissipation and maintaining semiconductor integrity by controlling fluid flow direction and speed, enhancing cooling efficiency.
Implementation Method 1
A cold plate with an inlet and outlet for a cooling liquid is attached to the chip. A cold plate is commonly made from a high thermal conductivity material to enable liquid flowing through the cold plate to transfer the heat away.
Implementation Method 2
The cooling system functions to transfer heat from the semiconductor device to another location where it can dissipate or diffuse heat, such as ambient air through the use of a radiator or a fan.
Implementation Method 3
A thermally conductive material, such as a thermal interface material, may be used to join the cooling system directly to the microelectronic elements.
Data Source
Figure 1
Figure 2A~2C
Figure 3~3A
AI summary
A semiconductor chip package includes a package substrate, at least one semiconductor chip, and a cold plate lid. The cold plate lid may be configured to cool the at least one semiconductor chip and minimize warpage of the package substrate. The cold plate lid may be bonded to the package substrate and thermally bonded to the rear surface of the at least one semiconductor chip. The cold plate lid further comprises an outer housing, a fluid inlet and a fluid outlet, and a flow plate. The outer housing may define an interior space and have a bottom surface bonded to the at least one semiconductor chip. The flow plate divides the interior space into an upper chamber and a lower chamber. Fluid flows from the upper chamber through apertures in the flow plate and into the lower chamber in a direction perpendicular to the rear surface of the semiconductor chip.