Cold Plate Module Cooling via Interconnected Conduits
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Solution Overview
Problem
Current cooling devices for server systems face challenges in efficiently transferring heat from electronic components while preventing coolant leakage and optimizing cooling efficacy, particularly in ensuring uniform temperature distribution across components.
Innovation Solution
The proposed cooling device incorporates a configuration of cold plates and a heat conductor, with internal flow-channel configurations such as parallel, serpentine, or checkerboard channels, and thermal interfaces like grease or solder, to effectively transfer heat through a liquid coolant, ensuring efficient cooling of both front and rear electronic components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a liquid coolant is used to transfer heat from electronic components to the cooling device, then heat transfer efficiency is improved, but the risk of coolant leakage onto components increases
Solution Approach 1:
The patent introduces a sealed cold plate structure as an intermediary between the coolant and electronic components. The cold plate contains internal channels that guide coolant flow while the external surface provides thermal contact with components, preventing direct exposure and potential leakage onto components.
Solution Approach 2:
The patent employs a liquid coolant circulation system with sealed conduits and cold plates designed to contain and direct fluid flow. The hydraulic design ensures controlled coolant movement through enclosed channels while maintaining thermal contact with heat-generating components.
2Ease of manufacture
If cooling devices are designed with simple structures, then ease of manufacture is improved, but cooling efficacy and uniform temperature distribution deteriorate
Solution Approach 1:
The cooling device is segmented into multiple cold plates, each with dedicated internal channels. This segmentation allows each plate to be optimized for specific cooling zones while maintaining uniform temperature distribution across different components, and each segment can be manufactured independently.
Solution Approach 2:
The patent implements local quality by providing customized cooling solutions for different regions. Each cold plate is configured with specific channel patterns and thermal interface materials tailored to the heat generation characteristics of individual electronic components, ensuring optimal cooling efficacy for each location.
3Temperature
If multiple cold plates are used to cool different components, then cooling coverage is improved, but device complexity increases
Solution Approach 1:
The patent merges multiple cold plates into an integrated cooling assembly where plates are coupled together through connecting conduits. This combining approach extends cooling coverage to multiple components while reducing overall system complexity compared to separate cooling systems for each component.
Solution Approach 2:
The cooling device achieves multi-functionality by using a single integrated system with multiple cold plates that can cool different electronic components simultaneously. The universal coolant circulation system serves multiple cooling zones, reducing the need for separate cooling systems for each component.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration achieves a temperature change of 1° to 15° Celsius in the heat conductor and a pressure drop of 1 to 20 kiloPascals, effectively cooling CPUs by 0.005° to 5° Celsius, maintaining a case temperature between 40° and 90° Celsius, thereby enhancing cooling efficiency and preventing coolant leakage.
Implementation Method 1
Another way to assist in the transfer of heat from an area of higher temperature to an area of lower temperature is with the addition of components that promote heat conduction or convection
Implementation Method 2
Another way to assist in the transfer of heat from an area of higher temperature to an area of lower temperature is with the addition of components that promote heat conduction or convection
Implementation Method 3
The heat conductor is coupled between the first outlet surface and the second inlet surface
Data Source
AI summary
A cooling device for a computing system is disclosed. The cooling device includes an inlet conduit, a first cold plate, a connecting conduit, a second cold plate, an outlet conduit, and a heat conductor. Coolant flows through the inlet conduit. The first cold plate has a first inlet surface and a first outlet surface. The inlet conduit is coupled to the first inlet surface. The inlet conduit transfers the coolant into the first cold plate. The connecting conduit is coupled at one end to the first outlet surface. The coolant flows from the first cold plate through the connecting conduit. The second cold plate has a second inlet surface and a second outlet surface, the connecting conduit being coupled at another end to the second inlet surface. The outlet conduit is coupled to the second outlet surface. The coolant flows from the second cold plate through the outlet conduit.