Cold Plate Multi-Level Cooling Surface for Undulating Heat Sources
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Solution Overview
Problem
Conventional cooling devices face difficulties in efficiently cooling heat-generating components with undulations due to a reduced thermal connection area, leading to inadequate heat dissipation.
Innovation Solution
A cold plate design featuring an opposing portion with a first and second cooling surface, spaced apart to increase the thermal contact area with the heat-generating component, and a heat exchange chamber that conducts heat to a refrigerant, enhancing cooling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a conventional base member with a single opposing plane is used, then the structure is simple, but the thermal contact area with undulating heat generating components is reduced
Solution Approach 1:
The invention transitions from a single-plane contact structure to a multi-level contact structure by providing cooling surfaces at different positions in the first direction (different depths/levels). This dimensional change allows the cooling surfaces to contact different regions of the undulating heat generating component, thereby increasing the total thermal contact area without significantly complicating the overall device structure.
Solution Approach 2:
The opposing portion is divided into multiple cooling surfaces (first cooling surface and second cooling surface) positioned at different levels. This segmentation allows each cooling surface to independently contact different regions of the undulating heat generating component, maximizing the thermal contact area while maintaining structural simplicity through the integrated opposing portion design.
2Area of stationary object
If the opposing portion is provided with multiple cooling surfaces at different positions, then the thermal contact area increases, but the device complexity increases
Solution Approach 1:
Multiple cooling surfaces are merged into a single integrated opposing portion structure. Instead of using separate components for each cooling surface, the invention combines them into one opposing portion that includes both the first cooling surface and the second cooling surface at different positions, thereby increasing thermal contact area while minimizing device complexity.
3Device complexity
If a single cooling surface is used, then the device complexity is low, but the cooling performance is insufficient for undulating components
Solution Approach 1:
The invention adds the first direction (depth/level dimension) to the cooling surface arrangement, creating cooling surfaces at different positions along this direction. This enables the cooling system to effectively contact undulating heat generating components with varying heights, thereby improving cooling performance without requiring a proportional increase in device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design allows for efficient cooling of heat-generating components with undulations by increasing the thermal contact area and reducing the number of pipes needed, resulting in improved cooling performance.
Implementation Method 1
The heat exchange chamber includes at least the opposing portion and the cover portion to conduct heat from the heat generating component to a refrigerant through the opposing portion
Data Source
AI summary
A cold plate includes an opposing portion, a cover portion, and a heat exchange chamber. The opposing portion opposes a heat generating component on one side in a first direction. The cover portion is arranged on another side of the opposing portion in the first direction. The heat exchange chamber includes at least the opposing portion and the cover portion to conduct heat from the heat generating component to a refrigerant through the opposing portion. The opposing portion includes a first cooling surface and a second cooling surface. The first cooling surface is provided on the one side in the first direction. The second cooling surface is provided on the one side in the first direction. The second cooling surface is spaced away from the first cooling surface in the first direction.