Cold Plate With Openings For Free Space Optical Interconnects
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Solution Overview
Problem
Free space optical interconnect systems face challenges in maintaining precise alignment due to vibrations and temperature fluctuations, which can lead to performance deterioration, and additional structural support for stability often restricts airflow and cooling.
Innovation Solution
Integration of a cooling module with a cold plate and rigid housing to maintain optical elements in static alignment while allowing for adequate airflow and cooling, using a system module with a cold plate having openings for free space communication and a housing that prevents relative movement between circuit boards.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If additional structural support is used to prevent relative movement between optical interconnect systems, then alignment stability is improved, but airflow for cooling is restricted
Solution Approach 1:
The system is divided into separate functional modules - each optical device chip is mounted on its own circuit board with independent structural support. This segmentation allows each module to be stabilized individually while maintaining overall system cooling through distributed airflow paths, resolving the contradiction between structural stability and thermal management
Solution Approach 2:
A cold plate is introduced as an intermediary component between the optical device chips and the airflow path. The cold plate provides thermal conduction for cooling while its design with openings allows airflow to pass through, thereby maintaining both cooling efficiency and alignment stability without direct structural restriction of airflow
2Temperature
If increased airflow is provided over optical interconnect systems for cooling, then temperature control is improved, but vibrations and air density variations increase causing misalignment
Solution Approach 1:
The cold plate is designed with localized openings positioned specifically at the optical path regions where alignment sensitivity is highest. This local quality approach allows airflow to be directed away from critical optical alignment zones while maintaining overall cooling, thereby reducing vibration-induced misalignment while preserving temperature control
Solution Approach 2:
The cold plate acts as a mediator that decouples the cooling function from the optical alignment stability. By providing thermal management through conduction rather than direct forced convection over the optical paths, it enables temperature control without introducing harmful airflow-induced vibrations and density variations
3Use of energy by moving object
If optical elements are positioned in close proximity to reduce power consumption, then energy efficiency is improved, but maintaining precise alignment becomes more difficult
Solution Approach 1:
The circuit board merges multiple functions - it provides mechanical support for mounting optical device chips, establishes precise spatial relationships between components through rigid PCB geometry, and enables close positioning of transmitting and receiving optical elements to minimize transmission power while maintaining alignment through the board's inherent structural precision
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables precise alignment and efficient cooling of optical elements, minimizing power consumption and maintaining high-performance data transfer rates without interference from mechanical misalignment or airflow variations.
Implementation Method 1
a cold plate 140 positioned between the first circuit board 114a and the second circuit board 114b
Implementation Method 2
The cold plate 140 includes a plurality of openings 142 that extend through the cold plate 140 and that are aligned with the optical elements 118a, 118b
Data Source
AI summary
An electronic system includes a first circuit board having a first optical element and a second circuit board having a second optical element positioned to electronically communicate with the first optical element over free space. The system also includes a cold plate having openings positioned to enable the optical communications over free space is positioned between the first circuit board and the second circuit board. The system further includes a condenser and a fluid conduit containing a cooling fluid configured to absorb heat through the cold plate and to convey the heat to the condenser, where the fluid conduit connects the cold plate and the condenser.