Cold Plate Partition Structure for Compact Liquid Cooling
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Solution Overview
Problem
Conventional liquid cooling systems for electronic components in compact arrangements are cumbersome due to the need for multiple cold plates, inlet pipes, and outlet pipes, leading to increased weight and installation complexity.
Innovation Solution
A cold plate design with a single inlet and outlet, incorporating a partition structure that divides the cooling chamber into multiple channels to distribute coolant effectively, allowing for efficient heat dissipation across multiple electronic components without the need for multiple pipe sets.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If each electronic component is provided with a set of cold plate, inlet pipe and outlet pipe, then heat dissipation effectiveness is improved, but system weight and installation complexity increase
Solution Approach 1:
The patent merges multiple cold plates, inlet pipes, and outlet pipes into a single integrated cold plate structure with multiple channels. The cold plate includes a first channel connected to a first inlet pipe and a second channel connected to a second inlet pipe, allowing multiple electronic components to be cooled through one unified structure instead of separate sets of components, thereby reducing installation complexity while maintaining heat dissipation effectiveness
Solution Approach 2:
The cold plate is designed as a universal cooling structure that can serve multiple electronic components simultaneously. The cold plate includes multiple channels (first channel, second channel, third channel) that can accommodate different electronic components, making it a multi-functional cooling solution that replaces multiple single-component cooling sets
2Temperature
If each electronic component is provided with a set of cold plate, inlet pipe and outlet pipe, then heat dissipation effectiveness is improved, but overall system weight increases
Solution Approach 1:
The patent combines multiple cooling components (cold plates, inlet pipes, outlet pipes) into a single integrated cold plate structure. By merging these components, the total number of parts is reduced, which directly decreases the overall system weight while maintaining the heat dissipation capability across multiple electronic components
3Quantity of substance
If multiple cold plates with inlet pipes and outlet pipes are used, then coolant distribution to electronic components is improved, but pipeline complexity and installation difficulty increase
Solution Approach 1:
The patent merges multiple inlet pipes and outlet pipes into a single cold plate structure with integrated channels. The cold plate includes a first channel connected to a first inlet pipe and a second channel connected to a second inlet pipe, eliminating the need for separate pipeline connections for each electronic component and significantly simplifying installation
Solution Approach 2:
The cold plate is segmented into multiple channels (first channel, second channel, third channel) within a single structure, allowing coolant to be distributed to different electronic components through internal channels rather than requiring external pipelines for each component, thereby maintaining coolant distribution effectiveness while simplifying installation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design results in a lightweight, simplified liquid cooling system that ensures sufficient coolant distribution to all electronic components, reducing overall weight and installation complexity while maintaining effective heat dissipation.
Implementation Method 1
The liquid cooling main body is in thermal contact with the electronic module
Implementation Method 2
coolant may flow into the cold plates from different inlet pipes, respectively. After the coolant absorbs heat in the cold plates
Data Source
AI summary
An electronic device includes a casing, an electronic module and a cold plate. The electronic module is accommodated in the casing. The cold plate is located in the casing and includes a liquid cooling main body and a partition structure. The liquid cooling main body is in thermal contact with the electronic module and has an inlet, an outlet and a chamber in communication with the inlet and the outlet. The partition structure is located in the chamber and defines a plurality of first channels and two second channels in the chamber. The first channels are located between and in communication with the two second channels. An extension direction of each of the first channels is different from an extension direction of each of the two second channels, and one of the two second channels is directly in communication with one of the inlet and the outlet.