Cold Plate Power and Optical Paths for High-Power IC Packaging
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Solution Overview
Problem
As ASIC process nodes advance and device power increases, delivering requisite power becomes more challenging, especially when packaged with a cold plate, due to additional thermal and power distribution difficulties.
Innovation Solution
The integration of power and optics through the use of cold plates with both electrical and optical paths allows for simultaneous power delivery and optical signal transmission to electronic and photonic integrated circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If power distribution is increased to meet higher device power requirements, then power delivery capability is improved, but thermal management difficulty increases
Solution Approach 1:
The patent combines power distribution and thermal management functions into a single integrated cold plate structure. The cold plate simultaneously serves as a power delivery substrate and a heat dissipation device, with power traces embedded within the cold plate to deliver power directly to the device while the cold plate's coolant channels remove generated heat, resolving the contradiction between increased power delivery and thermal management difficulty
Solution Approach 2:
The cold plate is designed as a multi-functional component that performs multiple roles: it acts as a mechanical support structure, an electrical power distribution network with embedded traces, and a thermal management system through integrated coolant channels. This multi-functionality allows the system to handle both high power delivery and effective heat removal without requiring separate dedicated structures for each function
2Temperature
If cold plate packaging is used for thermal management, then heat dissipation is improved, but power delivery complexity increases
Solution Approach 1:
The patent merges the power delivery network with the cold plate structure by embedding power traces directly into the cold plate's substrate. This integration eliminates the need for separate power delivery components and interconnections, reducing overall system complexity while maintaining effective heat dissipation through the cold plate's coolant channels
3Power
If additional components are added to deliver power through cold plate, then power delivery is improved, but device complexity increases
Solution Approach 1:
The cold plate is designed as a universal platform that simultaneously provides mechanical support, electrical power distribution through embedded traces, and thermal management through integrated coolant channels. This multi-functional design delivers effective power to the device without requiring additional separate components, thereby avoiding increased package complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively addresses the challenges of power and thermal management by enabling efficient power distribution and optical signal transmission within a single package, enhancing the performance and reliability of integrated circuits.
Implementation Method 1
When the ASIC or other electronic integrated circuit is packaged with a cold plate
Implementation Method 2
optical paths for transmitting optical signals through the cold plate
Data Source
AI summary
In one embodiment, an apparatus includes an upper cold plate and a lower cold plate, at least one of the upper cold plate or the lower cold plate comprising an electrical or optical path extending therethrough, a substrate and die package interposed between the upper cold plate or the lower cold plate, and a connector coupled to one of the upper cold plate or the lower cold plate for transmitting power or an optical signal through the electrical or optical path to the substrate and die package.