Cold Plate Power and Waveguide Routing for Integrated Circuit Cooling
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Solution Overview
Problem
As ASIC process nodes advance and device power increases, delivering power to electronic and photonic integrated circuits while managing thermal challenges becomes more complex, especially when packaged with a cold plate, and integrating optics and power distribution presents additional difficulties.
Innovation Solution
The integration of electrical and optical paths through cold plates allows for simultaneous power delivery and optical signal transmission to electronic and photonic integrated circuits, using power delivery blocks with vias for power transmission and optical elements like waveguides for signal passage, with connectors for coupling power and signals through the cold plates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If power delivery blocks with vias are integrated into cold plates for power transmission, then power delivery capability is improved, but device complexity increases
Solution Approach 1:
The patent combines power delivery blocks with cold plates into a single integrated structure. The cold plate serves dual functions as both a thermal management component and a power distribution substrate, with power vias embedded directly in the cold plate body. This merging eliminates the need for separate power delivery structures, thereby improving power delivery capability while managing device complexity through functional integration.
2Productivity
If optical elements like waveguides are integrated into cold plates for signal transmission, then optical signal transmission capability is improved, but device complexity increases
Solution Approach 1:
The patent integrates optical waveguides directly into the cold plate structure, allowing the cold plate to simultaneously perform thermal management and optical signal transmission functions. The waveguides are embedded within the cold plate body, enabling optical signals to be routed alongside power delivery paths without requiring separate optical mounting structures, thus improving transmission capability while containing complexity through unified design.
Solution Approach 2:
The cold plate is designed as a multi-functional component that concurrently provides thermal cooling, power distribution, and optical signal transmission. By making the cold plate universal in its functions, the patent reduces the total number of discrete components needed in the system, thereby improving overall productivity and signal transmission capability while managing device complexity through functional consolidation.
3Ease of operation
If connectors are added for coupling power and signals through cold plates, then ease of operation is improved, but device complexity increases
Solution Approach 1:
The connectors are designed to interface with the multi-functional cold plate, providing a unified coupling mechanism that simultaneously establishes electrical power connections and optical signal paths. This universal connector design simplifies operation by allowing both power and signal coupling through a single connection action, while the integrated nature of the connector-cold plate interface helps manage overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively addresses the challenge of delivering power and optical signals to advanced integrated circuits, enhancing thermal management and maintaining efficient communication within data communications networks by integrating power and optics through cold plates.
Implementation Method 1
When the ASIC or other electronic integrated circuit is packaged with a cold plate
Implementation Method 2
optical elements like waveguides for signal passage
Data Source
AI summary
In one embodiment, an apparatus includes an upper cold plate and a lower cold plate, at least one of the upper cold plate or the lower cold plate comprising an electrical or optical path extending therethrough, a substrate and die package interposed between the upper cold plate or the lower cold plate, and a connector coupled to one of the upper cold plate or the lower cold plate for transmitting power or an optical signal through the electrical or optical path to the substrate and die package.