Cold Plate Assembly With S-Cell Bonding for High Heat Flux Cooling
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Solution Overview
Problem
Power electronic devices, particularly those using silicon-carbide, generate high heat flux due to their compact device footprint, necessitating improved cooling solutions while maintaining a compact package size.
Innovation Solution
The implementation of a cold plate with an S-cell and a reactive multilayer system (RMS) interposed between the S-cell and the cold plate's base wall, enhancing thermal conductivity and maintaining electrical insulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If silicon-carbide power electronic devices are used to reduce device footprint, then compactness is improved, but heat flux increases
Solution Approach 1:
An S-cell is introduced as an intermediary component between the silicon-carbide power electronic device and the cold plate. The S-cell acts as a thermal mediator that facilitates heat transfer from the high heat flux device to the cooling system, resolving the contradiction between compact device footprint and high heat flux generation.
Solution Approach 2:
The cold plate assembly uses a composite structure combining the S-cell with reactive multilayer systems that provide both thermal conduction pathways and electrical insulation. This composite approach enables effective heat dissipation while maintaining the compact silicon-carbide device footprint.
2Temperature
If reactive multilayer system is interposed between S-cell and cold plate, then thermal conductivity is improved, but electrical insulation must be maintained
Solution Approach 1:
The reactive multilayer system employs a composite material structure that integrates both thermally conductive layers and electrically insulating layers. This allows the system to simultaneously improve thermal conductivity for heat dissipation while maintaining electrical insulation between the S-cell and cold plate, preventing electrical short circuits.
Solution Approach 2:
The reactive multilayer system is segmented into multiple functional layers, with distinct layers dedicated to thermal conduction and electrical insulation. This segmentation allows each layer to optimize its specific function while working together as an integrated thermal management solution.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively increases heat flux from the S-cell to the cold plate, improving heat spreading and cooling performance, thereby addressing the thermal management challenges in compact power electronic devices.
Implementation Method 1
at least one reactive multilayer system interposed between the S-cell and a base wall of the cavity... effectively increases heat flux from the S-cell to the cold plate
Implementation Method 2
The at least one reactive multilayer system bonds the S-cell to the cold plate within the cavity
Data Source
AI summary
Cold plate assemblies, power electronics assemblies including the same, and power electronics systems including the same are disclosed. A cold plate includes an S-cell disposed within a cavity of the cold plate and at least one reactive multilayer system interposed between the S-cell and a base wall of the cavity.