Direct-Bonded Cold Plate Cooling for Semiconductor Hotspots

Solution Overview

Problem

Existing cooling systems for microelectronic devices suffer from reduced efficiency due to high thermal resistance at interfacial boundaries and within the system components, leading to increased chip temperatures and reduced performance.

Innovation Solution

Integrated cooling assemblies are embedded within device packages, featuring a cold plate directly bonded to the semiconductor device with inlet and outlet openings for coolant flow, reducing thermal resistance and enhancing temperature uniformity across the device.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional cooling systems with thermal interface materials are used, then the cooling system can be assembled with standard components, but the thermal resistance at interfacial boundaries reduces cooling efficiency

Engineering Contradiction:

Improvecooling efficiencyVSAvoidchip temperature

Core Design Contradiction:

ReliabilityVSTemperature

Solution Approach 1:

The cold plate is directly bonded to the semiconductor device, merging the cooling component with the device structure itself. This eliminates the thermal interface material layer and reduces cumulative thermal resistance, allowing more efficient heat transfer from the chip to the coolant

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The thermal interface material is extracted/removed from the system by implementing direct bonding between the cold plate and semiconductor device. This removes the source of interfacial thermal resistance that was present in traditional cooling systems

Inventive Principle:

Principle #2Taking out (Extraction)

2Reliability

If multiple components are placed between heat dissipating sources and heat dissipation devices, then the cooling system can provide comprehensive cooling coverage, but the cumulative thermal resistance increases

Engineering Contradiction:

Improvecooling efficiencyVSAvoidnumber of components

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

Multiple cooling functions are merged into a single integrated cold plate structure that is directly bonded to the semiconductor device. The cold plate includes integrated features such as coolant channels, inlet/outlet openings, and thermal coupling structures, eliminating the need for separate thermal interface materials, heat spreaders, and other intermediate components

Inventive Principle:

Principle #5Merging (Combining)

3Reliability

If thermal interface materials are used to facilitate heat transfer, then the thermal coupling between components can be established, but the thermal resistance of the interface material itself inhibits heat transfer

Engineering Contradiction:

Improvethermal couplingVSAvoidheat transfer loss

Core Design Contradiction:

ReliabilityVSLoss of energy

Solution Approach 1:

The cold plate is directly bonded to the semiconductor device, merging the cooling component with the device structure itself. This eliminates the thermal interface material layer and reduces cumulative thermal resistance, allowing more efficient heat transfer from the chip to the coolant

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The thermal interface material is extracted/removed from the system by implementing direct bonding between the cold plate and semiconductor device. This removes the source of interfacial thermal resistance that was present in traditional cooling systems

Inventive Principle:

Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The integrated cooling assemblies provide direct cooling to hotspot regions, improving temperature uniformity and reducing thermal resistance, thereby enhancing the performance and efficiency of semiconductor devices.

Implementation Method 1

a cold plate directly bonded to the semiconductor device... reducing thermal resistance and enhancing temperature uniformity across the device

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

inlet and outlet openings for coolant flow... provide direct cooling to hotspot regions

Methodology Applied

Scientific EffectConvection: Convection

Data Source

PatentUS20260018490A1Embedded cooling systems for advanced device packaging and methods of manufacturing the same

Publication Date: 2026.01.15 ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC

AI summary

A device package comprising an integrated cooling assembly comprising a semiconductor device and a cold plate directly bonded to the semiconductor device. The cold plate comprises a top portion, sidewalls extending downwardly from the top portion to a backside of the semiconductor device, an inlet opening, and an outlet opening. The top portion, the sidewalls, and the backside of the semiconductor device collectively define a coolant chamber volume therebetween. The inlet opening and the outlet opening are disposed in the top portion and are in fluid communication with the coolant chamber volume. The inlet opening is disposed above a hotspot region of the semiconductor device.