Liquid Cooled Chassis Cold Plate Spring Mounting
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Solution Overview
Problem
Rack-configured information handling systems face limitations in heat dissipation due to the inefficiencies of traditional air cooling methods, which restrict the utilization of available space and require more effective cooling solutions for heat-generating components.
Innovation Solution
The implementation of a liquid cooling subsystem with a cold plate attached to the node enclosure, utilizing springs to position the conduction surface in conductive proximity with heat-generating components, allowing for efficient thermal conduction and reduced height compared to air-cooled solutions, enabling series or parallel connections for fluid flow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If air cooling methods are used, then the system structure is simple, but heat dissipation efficiency is insufficient and space utilization is limited
Solution Approach 1:
The patent transitions from air cooling to liquid cooling by implementing a cold plate system with fluid channels. The cold plate is attached to the processor and uses circulating coolant to efficiently remove heat, achieving superior thermal management compared to conventional air cooling methods while maintaining a compact form factor.
Solution Approach 2:
The cold plate acts as an intermediary thermal management component between the heat-generating processor and the cooling system. It provides a large conduction surface area that interfaces with the processor, transferring heat to the coolant flowing through its internal channels, thus enabling efficient heat dissipation.
2Temperature
If cold plate is rigidly attached to node enclosure, then thermal conduction is maximized, but installation and servicing become difficult
Solution Approach 1:
The patent employs springs as flexible mounting elements to attach the cold plate to the node enclosure. This dynamic attachment method allows the cold plate to maintain optimal thermal contact with the processor while accommodating manufacturing tolerances and enabling easy installation and removal for servicing, eliminating the need for rigid fixed mounting.
Solution Approach 2:
The spring mounting system allows for adjustment of contact pressure and positioning, optimizing the thermal interface between the cold plate and processor. The flexible connection enables parameter optimization for both thermal performance and mechanical accessibility, facilitating easier installation and maintenance operations.
3Power
If more processing capacity is added to increase heat generation, then computational power increases, but heat dissipation requirements become more difficult to meet
Solution Approach 1:
The liquid cooling system with cold plate provides high-capacity heat removal capability that scales with increasing processor power. The circulating coolant efficiently transports heat away from high-density processing components, enabling the system to handle the thermal load generated by increased processing capacity without compromising thermal management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances heat dissipation capabilities, increases the utilization of available space, and simplifies installation and servicing while maintaining operational integrity, effectively addressing the limitations of traditional cooling methods.
Implementation Method 1
A spring is positioned between the inner surface of the node enclosure and the cold plate. The spring positions the conduction surface into conductive proximity with the at least one of the one or more heat-generating functional components.
Implementation Method 2
The cold plate presents a conduction surface to at least one of the one or more heat-generating functional components... allowing for efficient thermal conduction
Data Source
AI summary
An information handling system (IHS) includes a node enclosure containing one or more heat-generating functional components. A cold plate is attached to an inner surface of the node enclosure. The cold plate presents a conduction surface to a selected at least one of the one or more heat-generating functional components. A spring is positioned between the inner surface of the node enclosure and the cold plate. The spring positions the conduction surface into conductive proximity with the selected at least one of the one or more heat-generating functional components.