Cold Plate Attachment Stabilizing Arm Single Point

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Solution Overview

Problem

Current thermal solutions for electronic devices face challenges in achieving uniform pressure and thermal performance due to limited space and high thermal demands, often requiring multiple attachment points that increase complexity and cost, while also compromising on thermal resistance and device performance.

Innovation Solution

A cold plate attachment with a stabilizing arm that uses a single central attachment point to create a bending moment, distributing pressure evenly across the cold plate and heat source, reducing the need for multiple through holes and minimizing board space, while maintaining effective thermal transfer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If multiple attachment points are used to secure the cold plate, then the thermal performance and pressure distribution are improved, but the device complexity and manufacturing cost increase

Engineering Contradiction:

Improvethermal performanceVSAvoidattachment system complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The attachment system is segmented into a support structure attachment portion and a cold plate attachment portion connected by a load portion, allowing the functions of multiple attachment points to be distributed across separate components that work together to achieve uniform pressure distribution

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Multiple attachment functions are merged into a single integrated attachment system where the support structure attachment portion, load portion, and cold plate attachment portion work as one unified mechanism to provide both securing and pressure distribution functions

Inventive Principle:

Principle #5Merging (Combining)

2Stability of the object's composition

If multiple through holes are used in the support structure for attachment, then the stability and pressure distribution are improved, but the board space is reduced and manufacturing complexity increases

Engineering Contradiction:

Improvecold plate stabilityVSAvoidboard space

Core Design Contradiction:

Stability of the object's compositionVSArea of stationary object

Solution Approach 1:

The attachment system transitions from a two-dimensional planar attachment with multiple holes to a three-dimensional structure that extends vertically, using the load portion to create a bending moment that distributes pressure across the cold plate without requiring multiple through-holes in the support structure

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Device complexity

If a single attachment point is used to reduce complexity, then the device complexity is reduced, but the pressure distribution uniformity deteriorates

Engineering Contradiction:

Improveattachment system complexityVSAvoidpressure distribution uniformity

Core Design Contradiction:

Device complexityVSManufacturing precision

Solution Approach 1:

The load portion is designed with a curved or bent geometry that creates a bending moment when attached, transforming the single attachment point into an effective distributed pressure system that maintains manufacturing precision through its structural configuration

Inventive Principle:

Principle #14Spheroidality (Curvature)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enhances thermal performance by ensuring uniform pressure distribution and reduced thermal resistance, thereby improving device performance and reducing manufacturing costs by simplifying the attachment system.

Implementation Method 1

create a bending moment that distributes pressure evenly across the cold plate and heat source

Methodology Applied

Scientific EffectBending moment:

Implementation Method 2

maintaining effective thermal transfer

Methodology Applied

Scientific EffectThermal transfer: Conduction (thermal)

Data Source

PatentUS11576282B2Cold plate attachment with stabilizing arm

Publication Date: 2023.02.07 INTEL CORP

AI summary

Particular embodiments described herein provide for an electronic device that can be configured to include a printed circuit board, a heat source located on the printed circuit board, a cold plate over the heat source, and a pair of cold plate attachments with stabilizing arms. Each of the pair of cold plate attachments with stabilizing arms include a printed circuit board attachment portion secured to the printed circuit board using only a single through hole, a load portion that extends from the printed circuit board attachment portion towards the cold plate, a cold plate attachment portion that secures the cold plate attachment with stabilizing arm to the cold plate, and a stabilizing portion that extends from the cold plate attachment portion to the printed circuit board.