Cold Plate Vapor Compression Cooling for High-Power Electronics
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Solution Overview
Problem
High-power electronic systems generate increased heat density, requiring more efficient cooling methods than traditional air cooling or heat sinks, especially as electronic devices shrink and integrate more components, and existing cooling systems face challenges in managing higher heat loads without significant infrastructure changes.
Innovation Solution
A cold plate system integrated with a vapor compression cycle and a thermally conductive body, where a first cooling fluid removes heat from a second cooling fluid in the condenser portion, enhancing heat dissipation through a vapor compression cycle and mechanical coupling to a heat source, supplemented by air cooling from a vapor cycle compression system.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If traditional air cooling or heat sink techniques are used, then the system structure remains simple, but the heat dissipation capability is insufficient for high-power electronic systems
Solution Approach 1:
The patent combines a vapor compression cycle system with a cold plate cooling system into an integrated thermal management unit. The condenser of the vapor compression system is thermally coupled with the cold plate, allowing the cooling fluid to absorb heat from both the electronic components and the condenser simultaneously, thereby enhancing heat dissipation capability while managing system complexity through functional integration
Solution Approach 2:
The invention changes the operating parameters of the cooling system by allowing the coolant to absorb heat at elevated temperatures from the condenser in addition to the cold plate. This parameter change enables the system to handle higher heat loads by increasing the temperature differential and heat transfer efficiency, transitioning from traditional low-temperature cooling to a higher-temperature thermal management approach
2Power
If high-power electronic components are added to increase system capability, then the system power increases, but the heat load increases requiring more extensive cooling infrastructure
Solution Approach 1:
The cooling system is designed with multi-functionality where the same cooling fluid circulation system serves dual purposes: cooling the electronic components through the cold plate and condensing refrigerant vapor from the vapor compression cycle. This universal cooling approach allows high-power systems to be cooled without requiring separate cooling infrastructures for different heat sources
Solution Approach 2:
The patent merges the cooling function for electronics with the refrigerant condensation function into a single thermal management system. The condenser is positioned to transfer heat to the cooling fluid that also cools the electronic components, combining what would traditionally be separate cooling requirements into one integrated solution that handles high heat loads without extensive infrastructure
3Power
If coolant flow temperature is increased to transport greater heat quantities, then the heat transport capacity increases, but the cooling effectiveness at the heat source decreases
Solution Approach 1:
The invention changes the temperature parameters of the cooling system by introducing a two-stage heat absorption process. The cooling fluid first absorbs heat at a lower temperature from the electronic components through the cold plate, then absorbs additional heat at a higher temperature from the condenser. This parameter change allows the system to transport greater heat quantities while maintaining effective cooling at the heat source through the temperature gradient
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively manages high heat loads by integrating a vapor compression cycle with a cold plate system, enhancing heat dissipation efficiency and allowing for increased coolant flow temperatures, thereby improving thermal management in high-power electronic systems without extensive system revamping.
Implementation Method 1
Cooling fluid travels through the cold plate cooling channel to remove heat from the conductive body via convection
Implementation Method 2
The first cooling fluid removes heat from a second cooling fluid in the condenser portion of the vapor compression cycle system
Implementation Method 3
air cooled by a vapor cycle compression system is passed over the heat source
Implementation Method 4
vapor compression cycle system
Implementation Method 5
conducting heat from a heat source to a cold plate
Data Source
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AI summary
A cold plate device and method for cooling electronic systems is provided including a generally flat thermally conductive body, 12, having a cooling channel within the thermally conductive body. A first cooling fluid travels through the cooling channel to remove heat from the conductive body, A vapor compression cycle system, 212, is coupled to the thermally conductive body such that the first cooling fluid removes heat from a second cooling fluid in a portion of the vapor compression cycle system, 212.