Integrated Cold Plate and VR Heatsink for Processor Thermal Loads
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Solution Overview
Problem
Existing thermal management systems for electronic devices, particularly for processors and voltage regulators, face challenges in effectively dissipating heat, leading to overheating and reduced reliability and lifespan.
Innovation Solution
A cooling assembly comprising a cold plate with liquid coolant ports and a removable VR heatsink with fins and a heatsink base, which is attached to both the processor and voltage regulator, allowing efficient heat transfer and circulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a cold plate is used to cool the processor, then heat dissipation is improved, but the voltage regulator also generates heat that requires additional cooling components
Solution Approach 1:
The patent combines the processor cold plate and voltage regulator heatsink into a single integrated cooling assembly. The cold plate includes both a processor cooling portion and a voltage regulator cooling portion with integrated liquid coolant flow paths, eliminating the need for separate cooling systems and reducing overall complexity while cooling both components effectively
2Temperature
If a VR heatsink is permanently attached to the cold plate, then thermal contact is improved, but maintenance and replacement become difficult
Solution Approach 1:
The cooling assembly is segmented into removable portions. The voltage regulator heatsink is designed as a separate, removable component that can be detached from the cold plate without damaging either component. This segmentation maintains effective thermal contact during operation while enabling easy maintenance and replacement when needed
3Productivity
If cooling components are optimized for processor only, then processor cooling efficiency is improved, but voltage regulator overheating occurs
Solution Approach 1:
The cold plate is designed with multi-functionality to cool both the processor and voltage regulator simultaneously. It includes a processor cooling portion with optimized flow paths for high-performance processor cooling, plus an integrated voltage regulator cooling portion with its own flow paths, allowing the single component to perform multiple cooling functions effectively
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances heat dissipation, preventing overheating and prolonging the lifespan of electronic devices by effectively managing thermal loads on processors and voltage regulators.
Implementation Method 1
cold plate is attached to a processor... Liquid coolant is circulated through the cold plate
Implementation Method 2
pump circulates a liquid coolant through the cold plate
Implementation Method 3
heatsink base that is attached to a heatsink mounting surface of a voltage regulator
Implementation Method 4
VR heatsink comprises a plurality of fins... increase surface area and dissipate heat
Data Source
AI summary
Disclosed is a cooling assembly for processors and voltage regulators. A processor is attached to a cold plate. A voltage regulator heatsink is removably attached to the cold plate. The voltage regulator heatsink has cooling fins and a heatsink base. The heatsink base is attached to a voltage regulator. Liquid coolant is flowed through the cold plate to cool the processor and the voltage regulator.