Cold Spray Deposition with Heated Substrate

Solution Overview

Problem

The existing cold spray process for depositing thick metal layers requires frequent heat treatments to manage residual stress, increasing the number of unit deposition processes and thereby prolonging the manufacturing time and increasing costs due to the need for repeated setup and adjustment of the cold spray apparatus.

Innovation Solution

The method involves performing the cold spray layer deposition process while the deposition target is heated, either in a non-oxidizing gas atmosphere or under vacuum conditions, and includes heat treatment steps to reduce residual stress, thereby reducing the number of heat treatments required and enhancing adhesion strength to prevent layer separation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If frequent heat treatments are performed to manage residual stress during cold spray deposition, then layer separation is prevented, but manufacturing time increases and production costs increase

Engineering Contradiction:

Improvelayer adhesion strengthVSAvoidmanufacturing time

Core Design Contradiction:

ReliabilityVSLoss of time

Solution Approach 1:

The base member is pre-heated to a specific temperature range (room temperature to 500°C) before cold spray deposition begins. This preliminary heating action reduces residual stress accumulation during deposition, allowing thicker layers to be formed without frequent heat treatment interruptions, thereby reducing total manufacturing time while maintaining layer adhesion strength

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The invention changes the temperature parameter of the base member during deposition by controlling the heating temperature to be within a specific range (room temperature to 500°C). This parameter change optimizes the balance between deposition rate and residual stress management, reducing the frequency of heat treatment cycles needed

Inventive Principle:

Principle #35Parameter changes

2Reliability

If frequent heat treatments are performed to manage residual stress, then layer separation is prevented, but production costs increase due to repeated setup and adjustment

Engineering Contradiction:

Improvelayer adhesion strengthVSAvoidmanufacturing cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The base member is pre-heated to a specific temperature range (room temperature to 500°C) before cold spray deposition begins. This preliminary heating action reduces residual stress accumulation during deposition, allowing thicker layers to be formed without frequent heat treatment interruptions, thereby reducing total manufacturing time while maintaining layer adhesion strength

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

By pre-heating the base member to the optimal temperature range before deposition, the cold spray process can continue more continuously without frequent interruptions for heat treatment. This maintains the useful deposition action throughout the process, reducing the number of setup and adjustment cycles that increase manufacturing costs

Inventive Principle:

Principle #20Continuity of useful action

3Productivity

If the cold spray process is used to deposit thick metal layers, then layer growth rate increases compared to electroplating, but residual stress increases with layer thickness causing separation

Engineering Contradiction:

Improvelayer growth rateVSAvoidlayer adhesion strength

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The invention changes the temperature parameter of the base member during deposition by controlling the heating temperature to be within a specific range (room temperature to 500°C). This parameter change optimizes the balance between deposition rate and residual stress management, reducing the frequency of heat treatment cycles needed

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The base member is pre-heated to a specific temperature range (room temperature to 500°C) before cold spray deposition begins. This preliminary heating action reduces residual stress accumulation during deposition, allowing thicker layers to be formed without frequent heat treatment interruptions, thereby reducing total manufacturing time while maintaining layer adhesion strength

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach decreases the number of heat treatments needed, reduces manufacturing costs, and enhances the adhesion strength of the deposited layer, allowing for thicker layers to be formed without separation, thus improving the efficiency and reliability of the cold spray process.

Implementation Method 1

depositing the layer on a deposition target by a cold spray process while the deposition target is heated by a heater

Methodology Applied

Scientific EffectHeating: Heating

Implementation Method 2

the material particles are supplied in the high-speed gas flow and are accelerated, and the material particles in a solid state are impinged on the base member to form the layer

Methodology Applied

Scientific EffectCold spray deposition: Deposition (physical)

Implementation Method 3

heat treating the deposition target after the depositing

Methodology Applied

Scientific EffectHeat treatment: Heat Treatment

Data Source

PatentUS9951426B2Method for depositing layer

Publication Date: 2018.04.24 MITSUBISHI HEAVY IND LTD

AI summary

A method for depositing a layer includes repeatedly performing a unit deposition process until the layer on a deposition target reaches a predetermined thickness. The unit deposition process includes (depositing the layer on the deposition target by a cold spray process while the deposition target is heated by a heater and heat treating the deposition target after the depositing.