Cold-Spray Heat-Dissipating Substrate With Crack-Resistant Bonding
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Cold spray coating layers on heat-dissipating substrates have low bonding strength and often form complex, diverse, and unpredictable microstructures or cracks due to solid-phase metal powder and high-pressure gas spraying.
Innovation Solution
A heat-dissipating substrate structure with a base layer and a cold spray coating layer formed by spraying solid-phase metal powder with an apparent density of 3 to 4 g/cm3 and median particle diameter of 30 μm or less, using a high-pressure compressed gas, and embedding the coating layer with a maximum depth of 100 μm or less, along with internal cooling fins for enhanced heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If high-pressure compressed gas is used to spray solid-phase metal powder onto the base layer, then the bonding strength of the coating layer is improved, but complex microstructures and cracks are formed in the coating layer
Solution Approach 1:
The patent changes the physical parameters of the metal powder (apparent density of 3 to 4 g/cm3 and median particle diameter of 30 μm or less) to optimize the spraying process. This parameter adjustment allows achieving high bonding strength (40 MPa or more) while preventing the formation of complex microstructures and cracks that occur with conventional powder specifications.
2Ease of manufacture
If solid-phase metal powder is sprayed onto the heat-dissipating substrate, then the coating layer is formed, but the bonding strength between the coating layer and substrate is low
Solution Approach 1:
The patent specifies precise parameters for the metal powder (apparent density of 3 to 4 g/cm3 and median particle diameter of 30 μm or less) to achieve optimal bonding strength of 40 MPa or more while maintaining ease of coating formation through cold spray process.
3Strength
If the metal powder is deeply embedded in the base layer due to high-pressure spraying, then the bonding strength is improved, but complex microstructures and cracks are formed
Solution Approach 1:
The patent optimizes the metal powder parameters (apparent density of 3 to 4 g/cm3 and median particle diameter of 30 μm or less) to achieve adequate embedding depth for strong bonding (maximum depth of 100 μm or less) while preventing the formation of complex microstructures and cracks that occur with deeper embedding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The bonding strength of the coating layer reaches 40 Mpa or more, preventing complex microstructures and cracks, while maintaining effective heat dissipation through optimized layer thickness ratios and cooling fin configurations.
Implementation Method 1
The cold spray coating layer is a film formed on the top surface of the base layer by spraying a solid-phase metal powder and a high-pressure compressed gas onto the base layer
Implementation Method 2
The at least one internal cooling fin is joined to a bottom surface of the base layer
Implementation Method 3
at least one internal coolant passage is defined between the base layer, the at least one internal cooling fin, and an interior of the cooler
Data Source
AI summary
The heat-dissipating substrate structure includes a base layer and a cold spray coating layer. The cold spray coating layer is formed on a surface of the base layer. The cold spray coating layer is a film formed on the surface of the base layer by spraying a solid-phase metal powder and a high-pressure compressed gas onto the base layer. The solid-phase metal powder at least includes a film-forming powder with an apparent density of 3 to 4 g/cm3 and a median particle diameter (D50) of 30 μm or less. A maximum depth of a bottom of the cold spray coating layer embedded in the base layer is less than 60 μm. A cooler contains an internal cooling fin joined to the base layer. An internal coolant passage is defined between the base layer, the internal cooling fin, and an interior of the cooler.