Cold-Start Compute Module Heating Through Liquid-Cooled Plate
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Solution Overview
Problem
Existing onboard computer systems in vehicles struggle to operate reliably below 0 degrees Celsius due to limitations in integrated circuits, and current heating methods such as coolant heaters and resistive heaters are inefficient and can cause issues like boiling or require additional hardware.
Innovation Solution
Utilizing select integrated circuits capable of low-temperature operation to generate heat by overclocking, applying higher voltage, or running special workloads, which dissipate heat into a thermally-conducting plate coupled to the onboard computer, without requiring extra hardware or control circuitry.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If coolant heaters are used to heat the onboard computer, then the computer can operate in cold temperatures, but the coolant can boil locally creating problems and wasting energy
Solution Approach 1:
The patent applies the self-service principle by using the onboard computer's own integrated circuits to generate heat for warming the system during cold starts, rather than relying on external coolant heaters. The computing components perform computational work that generates heat as a byproduct, and this heat is directed back to warm the onboard computer, making the system self-sufficient for temperature conditioning.
2Temperature
If resistive heaters are attached to the onboard computer surface, then the computer can be heated, but additional hardware and control circuitry are required
Solution Approach 1:
The system uses the onboard computer's existing integrated circuits to generate heat through computational workloads, eliminating the need for external resistive heaters and their associated control circuitry. The computing components serve dual purposes: performing computational tasks and generating heat for temperature conditioning.
Solution Approach 2:
The integrated circuits perform multiple functions: they execute computational workloads for system operation and simultaneously generate heat to warm the onboard computer during cold starts. This multi-functionality eliminates the need for dedicated heating hardware.
3Adaptability or versatility
If integrated circuits operate below 0 degrees Celsius, then the system can function in cold environments, but the integrated circuits cannot be reliably operated below this temperature
Solution Approach 1:
The system performs preliminary heating action by executing computational workloads before the main system startup to raise the temperature of the onboard computer and integrated circuits above 0 degrees Celsius. This preliminary thermal conditioning ensures that when the integrated circuits are activated for normal operation, they are already at a reliable operating temperature.
Solution Approach 2:
The integrated circuits warm themselves by performing computational work during the cold start phase, eliminating the need for external heating systems and ensuring reliable operation once the temperature threshold is reached.
4Device complexity
If computing components are used to generate heat for the main computer, then no additional heating hardware is needed, but the computing components must operate at higher power levels
Solution Approach 1:
The patent converts the harmful effect of excess heat generation during computing operations into a beneficial effect by directing this heat to warm the onboard computer during cold starts. The computational workloads that would normally generate waste heat are instead utilized as a heating source, eliminating the need for separate heating systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively heats the onboard computer to operational temperatures without additional hardware, ensuring reliable startup in cold conditions while optimizing energy use and avoiding electromagnetic compatibility issues.
Implementation Method 1
The one or more computing components can be thermally coupled to a main computer via a liquid-cooled plate... Running the set of program instructions on at least one computing component can generate heat that flows to the main computer via the liquid-cooled plate
Implementation Method 2
detecting, from at least one thermal sensor coupled to the liquid-cooled plate, a temperature reading indicative of a temperature of the main computer
Implementation Method 3
Running the set of program instructions on at least one computing component can generate heat
Data Source
AI summary
Example embodiments relate to methods of increasing a temperature of a computer module to start the computer at environmental temperatures below a threshold temperature. An example embodiment includes receiving, at one or more computing components thermally coupled to a main computer via a liquid-cooled plate, a set of program instructions. The method can also include running the set of program instructions on at least one computing component. Running the set of program instructions on the computing component can generate heat that flows to the main computer via the liquid-cooled plate. The method can additionally include detecting, from at least one thermal sensor coupled to the liquid-cooled plate, a temperature reading indicative of a temperature of the main computer. The method can further include determining that the temperature reading has reached a predetermined temperature threshold and based on the temperature reading reaching the predetermined temperature threshold, powering on the main computer.