Collapse-Free Circuit Structure for Low-Capacitance 3D Integration
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Solution Overview
Problem
Existing transmission line structures face issues with parasitic capacitance changes causing impedance mismatch and structural collapse, especially in high frequency signal transmission, leading to signal quality degradation and stability problems.
Innovation Solution
A collapse-free circuit structure with low capacitance effect is designed, featuring a pad supported by a structurally insulated pad supporting structure and electrical insulation gaps, maintaining stable impedance and preventing structural collapse.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If the surface area of conductive plates is reduced to decrease capacitance, then the capacitance effect decreases, but the structural stability deteriorates causing collapse
Solution Approach 1:
The patent introduces a vertical dimension by stacking multiple circuit layers (first circuit layer, second circuit layer, third circuit layer) to reduce the surface area of conductive plates in each layer while maintaining overall structural stability through the layered configuration. This dimensional change allows capacitance reduction without compromising structural integrity.
Solution Approach 2:
The patent employs composite material structures by combining multiple dielectric materials (first dielectric, second dielectric, third dielectric) with conductive plates in a layered configuration. This composite structure reduces capacitance through the insulating properties of dielectrics while maintaining structural stability through the combined mechanical strength of multiple materials.
2Object-affected harmful factors
If openings are formed in the ground circuit layer to decrease capacitance, then the capacitance effect decreases, but the manufacturing complexity increases
Solution Approach 1:
The patent segments the circuit structure into multiple independent layers (first circuit layer, second circuit layer, third circuit layer) with distinct functions. Each layer can be manufactured and processed separately, reducing the manufacturing complexity associated with forming openings in a single ground layer while still achieving capacitance reduction.
Solution Approach 2:
Instead of forming openings in the ground circuit layer (2D approach), the patent moves to a 3D layered structure where capacitance is reduced by stacking multiple circuit layers with alternating conductive and dielectric materials. This dimensional change simplifies manufacturing by avoiding complex opening formation processes.
3Ease of manufacture
If the transmission line structure is simplified to improve ease of manufacture, then the ease of manufacture improves, but the signal quality deteriorates due to impedance mismatch
Solution Approach 1:
The patent systematically adjusts key parameters including the thickness of dielectric layers, the dimensions of conductive plates, and the spacing between layers to achieve both ease of manufacture and signal quality. By optimizing these parameters, the patent maintains characteristic impedance while simplifying the overall structure for easier manufacturing.
Solution Approach 2:
The patent creates a universal layered structure that serves multiple functions: it provides mechanical support, electrical insulation, and impedance control simultaneously. This multi-functional design simplifies manufacturing by using a standardized layered approach that achieves multiple goals without requiring complex specialized structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The structure maintains consistent impedance and improves signal quality by reducing capacitance, ensuring stable signal transmission and compatibility with other electrical components, suitable for 3D integrated circuits.
Implementation Method 1
the circuit layer dielectric is located between the pad and the pad supporting structure
Implementation Method 2
the pad and the upper circuit of the connection layer are spaced with an upper gap for electrical insulation; the pad supporting structure and the bottom circuit are spaced with a bottom gap for electrical insulation
Data Source
AI summary
A collapse-free circuit structure with low capacitance effect includes a circuit layer that is layered between a connection layer and a bottom circuit layer. A pad and an upper circuit of the connection layer are spaced with an upper gap for electrical insulation. The bottom circuit layer includes a bottom circuit and a pad supporting structure, wherein the pad supporting structure is located right below the pad. The pad supporting structure and the bottom circuit are spaced with a bottom gap for electrical insulation. The circuit layer includes a circuit layer dielectric, wherein the circuit layer dielectric is located between the pad and the pad supporting structure. The existence of the upper gap and the bottom gap ensures low capacitance effect between the connection layer and the bottom circuit layer. The pad supporting structure prevents the pad from collapsing.