Coating Liquid Collecting Member with Solvent Storage for Exhaust Path
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Solution Overview
Problem
In semiconductor manufacturing, high viscosity resist liquids used in spin coating often form string-shaped coating liquids that clog exhaust paths, leading to decreased exhaust pressure and poor throughput due to frequent maintenance needs and inefficient solvent usage.
Innovation Solution
A coating processing apparatus with a coating liquid collecting member featuring solvent storage portions and a solvent supply system that dissolves and removes string-shaped coating liquids during the coating process, maintaining exhaust pressure stability and reducing maintenance frequency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a coating liquid collecting member is installed in the exhaust path to collect string-shaped coating liquid, then the exhaust pressure stability is improved, but the device complexity increases due to additional cleaning requirements and maintenance processes
Solution Approach 1:
The coating liquid collecting member is designed to enable easy self-cleaning by the wafer rinse process. The rinse liquid naturally flows through the exhaust path and cleans the collecting member during the wafer cleaning operation, eliminating the need for separate cleaning systems or manual intervention.
Solution Approach 2:
The cleaning of the coating liquid collecting member is performed periodically during wafer rinse operations rather than requiring continuous maintenance. This integrates the cleaning function into the existing wafer processing cycle, reducing overall system complexity while maintaining exhaust pressure stability.
2Ease of operation
If rinse is supplied to clean the coating liquid collecting member during wafer processing, then the cleaning function is achieved, but the throughput decreases due to additional process time
Solution Approach 1:
The cleaning function for the coating liquid collecting member is merged with the existing wafer rinse process. The same rinse liquid and process timing are used for both wafer cleaning and collecting member cleaning, eliminating redundant operations and maintaining throughput.
Solution Approach 2:
The wafer rinse process is given multiple functions: it cleans the wafer surface and simultaneously cleans the coating liquid collecting member. This multi-functionality eliminates the need for dedicated cleaning resources and maintains high productivity.
3Reliability
If solvent is continuously supplied to dissolve coating liquid during resist coating, then the coating liquid removal is improved, but the chemical solution consumption increases
Solution Approach 1:
The system uses the wafer rinse liquid, which is already present in the process, to clean the coating liquid collecting member. This self-service approach eliminates the need for continuous solvent supply, significantly reducing chemical solution consumption while maintaining effective coating liquid removal.
Solution Approach 2:
Instead of continuously supplying fresh solvent, the system recycles the wafer rinse liquid for dual purposes (wafer cleaning and collecting member cleaning). This recovery and reuse approach reduces chemical consumption while maintaining cleaning effectiveness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus effectively collects and removes string-shaped coating liquids, stabilizing exhaust pressure and improving throughput by dissolving and removing them during the process, reducing the need for frequent cleaning and solvent usage.
Implementation Method 1
at least one solvent storage portion formed in the coating liquid collecting member and configured to store a first solvent for dissolving the coating liquid collected in the coating liquid collecting member
Data Source
AI summary
A coating processing apparatus includes: a substrate holding part for horizontally holding a substrate and configured to rotate around a vertical axis; a coating liquid supply part for supplying a coating liquid onto the substrate; a cup body surrounding the substrate; an annular exhaust path formed along a circumferential direction of the cup body between an inner peripheral surface of the cup body and an inner member installed inside the cup body; a coating liquid collecting member installed to cover the exhaust path and having an opening, and configured to collect the coating liquid scattering from the substrate; at least one solvent storage portion formed in the coating liquid collecting member and configured to store a first solvent for dissolving the coating liquid collected in the coating liquid collecting member; and a solvent supply part for supplying the first solvent to the at least one solvent storage portion.