Collector Device for Thermal Treatment Chamber Contamination
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Solution Overview
Problem
High-temperature thermal treatment systems for silicon or silicon-on-insulator substrates face contamination issues due to the condensation and delamination of silicon monoxide deposits on the inner walls of the chamber, which can contaminate substrates during loading and unloading, affecting their quality.
Innovation Solution
A thermal treatment system equipped with a collector device in the proximal portion of the chamber that redirects and condenses volatile species onto its inner surfaces, preventing them from forming deposits on the chamber walls and reducing contamination risks during substrate transit.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If thermal treatment is performed at high temperature to dissolve buried oxide, then substrate quality is improved, but silicon monoxide deposits form on chamber walls causing contamination
Solution Approach 1:
The harmful condensation process is extracted from the main chamber by introducing a separate collector device. The collector captures volatile species (SiO) before they can condense on chamber walls and contaminate substrates, separating the dissolution process in the chamber from the condensation process in the collector.
Solution Approach 2:
The collector device acts as an intermediary element between the high-temperature treatment zone and the substrate loading zone. It intercepts and captures volatile species transported by the gas stream, preventing them from reaching and contaminating the substrates during loading and unloading operations.
2Duration of action of stationary object
If quartz protective screens are placed in the chamber to collect deposits, then chamber lifespan is extended, but substrate contamination during loading/unloading is not prevented
Solution Approach 1:
The condensation function is extracted from the chamber environment and relocated to a dedicated collector device positioned in the gas outlet path. This removes the source of contamination from the substrate transit area while still capturing deposits.
Solution Approach 2:
The collector device is designed as a replaceable component that accumulates deposits until it becomes saturated, at which point it can be removed and replaced. This protects the expensive chamber from wear while using a disposable/c recyclable collector.
3Ease of manufacture
If gas outlet path is located at the bottom of the chamber, then gas discharge is simplified, but deposits form on loading column and chamber walls
Solution Approach 1:
The collector device is positioned as an intermediary in the gas outlet path, intercepting volatile species before they can travel to the loading column and chamber walls. It serves as a intermediate collection point that simplifies the overall discharge process while preventing unwanted deposition.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The collector device effectively limits the formation of contaminating deposits within the chamber, significantly reducing the risk of substrate contamination and extending the lifespan of expensive chamber components by directing condensation onto removable surfaces.
Implementation Method 1
the gas cools gradually when it leaves the area close to the heating elements 4 and circulates towards the exhaust 6. Since the SiO is not highly soluble in the heat-transfer gas, it condenses below a critical temperature on the solid portions of the bottom of the furnace 1
Data Source
AI summary
A thermal treatment system includes a chamber capable of receiving a plurality of substrates, a gas intake path in a distal portion of the chamber located opposite an area for entry of substrates into the chamber, and an outlet path for the gas and/or volatile species generated during the thermal treatment. The outlet path is located in a proximal portion of the chamber located near the area for entry of the substrates into the chamber. The system further includes a collector device in the proximal portion of the chamber. The collector device has a confinement opening oriented toward the distal portion of the chamber, and the collector device defines a compartment communicating with the outlet path, the compartment being configured so that the gas and the volatile species enter into the compartment via the confinement opening and pass through the compartment to reach the outlet path.