Collet Replacement Timing Using Die Bonding History Data
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Solution Overview
Problem
Existing bonding apparatuses require time-consuming shape detection of collets to determine replacement, leading to decreased productivity.
Innovation Solution
A bonding apparatus that determines collet replacement based on accumulated history information of die bonding operations, including information on the number of bonds, pressure, and type of collet used, without needing direct shape detection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If shape detection of collet is performed to determine replacement, then reliability of collet status assessment is improved, but productivity deteriorates due to time consumption
Solution Approach 1:
The patent replaces the mechanical/optical shape detection system with an information processing system that uses history information databases and determination units to assess collet status, eliminating the need for physical shape measurement while maintaining assessment reliability
Solution Approach 2:
The patent creates information copies of collet usage history and bonding parameters, using these data copies to determine collet replacement timing without needing to physically inspect the collet, thus avoiding productivity loss
2Manufacturing precision
If frequent collet replacement is performed to ensure bonding quality, then manufacturing precision is improved, but productivity deteriorates due to increased replacement operations
Solution Approach 1:
The patent implements a feedback mechanism where history information from bonding operations is continuously accumulated and analyzed, allowing the system to dynamically determine optimal collet replacement timing based on actual usage patterns and bonding quality data, replacing collets only when necessary
Solution Approach 2:
The patent changes the decision parameter for collet replacement from fixed schedule or shape measurement to dynamic assessment based on accumulated history information including bonding counts, pressure data, and operational parameters, enabling precision maintenance without excessive replacements
Data Source
AI summary
An apparatus for bonding a die and a bonded object is provided that includes a holding unit configured to hold the die, and a determination unit configured to determine replacement of the holding unit based on history information about bonding the die to the bonded object using the holding unit. The history information is an accumulated value of a use record when a plurality of dies is bonded to at least one of a plurality of bonded objects.


