Collet Suction Surface Segmentation for Semiconductor Die Bonding
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Solution Overview
Problem
The transfer and placement processes in semiconductor device manufacturing often result in defective products due to scars on the semiconductor chip surfaces caused by the collet during die bonding, leading to yield reduction and reliability issues.
Innovation Solution
A semiconductor device manufacturing method where the collet's suction surface is aligned with the semiconductor element's upper surface, ensuring the suction occurs over a region exclusive of the suction hole, preventing direct contact and pressure concentration on the chip's surface, thereby avoiding scars and improving yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the collet's suction hole is brought into direct contact with the upper surface of the semiconductor chip during transfer and placement, then the picking up process is simplified, but scars are caused on the chip surface leading to defective products
Solution Approach 1:
The upper surface of the semiconductor element is divided into a first region (lower area) and a second region (higher area). The suction hole is positioned to face the first region, while the second region serves as a non-contact pickup area. This spatial segmentation allows the suction function and the protective non-contact surface to coexist, resolving the contradiction between easy pickup operation and product quality.
Solution Approach 2:
The first region acts as an intermediary zone that receives the suction force through the suction hole, while the second region (upper surface) remains protected from direct contact. This intermediary arrangement allows the collet to pick up the element effectively while preventing scar formation on the critical upper surface, thus improving both ease of operation and reliability.
2Strength
If the collet contacts the uppermost surface of the semiconductor element during pickup, then secure holding is achieved, but scars are formed on the surface causing yield reduction
Solution Approach 1:
The surface is segmented into a first region for suction contact and a second region for protection. The suction hole faces the first region, allowing strong holding force through air suction, while the second region remains untouched. This segmentation enables secure holding without scar formation, thereby maintaining both strength and productivity.
Solution Approach 2:
The traditional mechanical contact-based holding is replaced with a pneumatic suction system. The suction hole creates negative pressure to hold the semiconductor element, eliminating the need for direct mechanical contact between the collet surface and the element's uppermost surface. This substitution provides secure holding force while preventing scar-induced yield loss.
3Ease of operation
If the suction hole is positioned to face the second region (higher area), then direct pickup is possible, but the uppermost surface of the semiconductor element is damaged
Solution Approach 1:
The element surface is segmented into a first region (lower) and a second region (higher). The suction hole is positioned to face the first region, allowing easy transfer operation through suction, while the second region maintains its surface integrity. This segmentation resolves the contradiction between ease of transfer and manufacturing precision.
Solution Approach 2:
The problem is solved by introducing a vertical dimension consideration. The first region is at a lower height while the second region is at a higher height. The suction hole faces the lower first region, allowing suction-based transfer without contacting the higher second region's surface. This dimensional approach enables easy transfer while preserving surface integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively suppresses the occurrence of scars on semiconductor elements, enhancing the reliability and yield of semiconductor devices by preventing damage during transfer and placement.
Implementation Method 1
picking up the semiconductor element using the collet while the collet sucks in air between the first region of the semiconductor element and the suction surface of the collet via the suction hole
Data Source
AI summary
A semiconductor device manufacturing method includes: (A) orienting an upper surface of a semiconductor element which has the upper surface and a suction surface of a collet which has a suction hole so that the upper surface of the semiconductor device and the suction surface of the collet face each other, the upper surface including a first region and a second region, the second region lying higher than the first region; (B) bringing the suction surface of the collet into contact with a part of the second region of the semiconductor element; and (C) picking up the semiconductor element using the collet while the collet sucks in air between the first region and the suction surface via the suction hole, wherein in (B), an entirety of an uppermost surface of the second region is in contact with a region of the suction surface exclusive of the suction hole.