Colloidal Crystal Detection Film for Mini LED Chip Tilt Inspection

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Solution Overview

Problem

Current methods lack an effective means to detect whether mini light-emitting diode (LED) chips bonded to a circuit board are tilted, which can affect display quality due to variations in light-emitting angles.

Innovation Solution

A detection film with colloidal crystal microspheres is used, which covers the bonded chip and utilizes the Bragg reflection effect to determine tilt angles by analyzing light reflected from the microspheres, allowing for the detection and classification of tilted chips.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If reflow soldering is performed at high temperature to bond LED chips to PCB, then bonding strength is improved, but chip tilt occurs affecting display quality

Engineering Contradiction:
Improvebonding strengthVSAvoidchip tilt angle
Core Design Contradiction:
StrengthVSManufacturing precision

Solution Approach 1:

The detection film is applied to the chip surface before the reflow soldering process. The colloidal crystal microspheres in the film pre-establish a reference structure that will reflect light differently based on any tilt that occurs during bonding, allowing detection of the tilt angle after bonding without requiring post-process measurement equipment.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The colloidal crystal microspheres in the detection film exhibit Bragg reflection that causes color changes in reflected light based on the tilt angle of the chip. Different tilt angles produce different reflected colors, enabling visual or instrumental detection of chip orientation after bonding.

Inventive Principle:
Principle #32Color changes

2Device complexity

If no detection means is used during chip bonding, then manufacturing complexity is reduced, but tilt detection capability is lost

Engineering Contradiction:
Improvedetection system complexityVSAvoidtilt angle measurement
Core Design Contradiction:
Device complexityVSMeasurement precision

Solution Approach 1:

The detection film acts as an intermediary between the chip and the detection system. Instead of requiring complex external measurement equipment, the film itself contains the detection mechanism through its colloidal crystal structure that naturally responds to tilt angles via Bragg reflection, simplifying the overall detection system.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The detection film is self-contained with the colloidal crystal microspheres that automatically provide tilt detection functionality. The film serves both as a protective coating and as the detection element itself, eliminating the need for separate detection devices and reducing system complexity.

Inventive Principle:
Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method enables the accurate detection of tilted chips, improving display quality by preventing poor light emission and enabling targeted maintenance and splicing of display panels, thus enhancing the overall performance and yield of LED display products.

Implementation Method 1

based on a Bragg reflection effect of the colloidal crystal microspheres, according to the characteristic that light reflected by colloidal crystal microspheres corresponding to chips having difference tilt angles after bonding varies

Methodology Applied
Scientific EffectBragg reflection: Bragg Diffraction

Data Source

PatentUS20240213418A1Detection Film and Manufacturing Method Therefor, Detection Method and Device for Chip Bonding, and Classification Method
Publication Date: 2024.06.27 CHONGQING KONKA PHOTOELECTRIC TECH RES INST CO LTD
  • US20240213418A1 patent drawing
  • US20240213418A1 patent drawing
  • US20240213418A1 patent drawing

AI summary

The disclosure relates to a detection film and a manufacturing method therefor, a detection method and device for chip bonding, and a classification method. A detection film (2) covers a chip bonded to a circuit board (11), the detection film (2) is internally provided with colloidal crystal microspheres (22) arranged in order, and based on a Bragg reflection effect of the colloidal crystal microspheres, whether each chip is tilted is determined according to light reflected by the colloidal crystal microspheres (22) on the chip.