Color Filter Layer Positioning for Semiconductor Joining Reliability
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Solution Overview
Problem
Existing semiconductor apparatuses face challenges in maintaining image quality and joining reliability due to the placement of the color filter layer between the light transmission plate and the semiconductor device, which can lead to interlayer delamination and reduced image quality.
Innovation Solution
The semiconductor apparatus is designed with a color filter layer positioned between the light transmission plate and both the effective pixel region and the peripheral region, with the outer edge of the color filter layer located between the effective pixel region and the joining member. This configuration ensures that the joining member does not directly contact the color filter layer, thereby improving joining strength and reliability while maintaining image quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the color filter layer is placed between the light transmission plate and the semiconductor device, then image quality is improved, but joining reliability deteriorates due to interlayer delamination
Solution Approach 1:
The color filter layer is extracted from the region directly beneath the joining member and repositioned to extend beyond the effective pixel region. This separation prevents the color filter layer from interfering with the joining process between the light transmission plate and semiconductor device, eliminating the delamination issue while preserving its optical function in the effective pixel region.
Solution Approach 2:
The color filter layer is segmented into different functional zones: one portion positioned within the effective pixel region to maintain image quality, and another portion extending beyond it to avoid contact with the joining member. This spatial segmentation allows the same layer to serve multiple purposes without causing delamination.
2Ease of manufacture
If the color filter layer is positioned close to the joining member, then manufacturing simplicity is improved, but image quality deteriorates due to reflections and crosstalk
Solution Approach 1:
The color filter layer is extended in the lateral dimension beyond the effective pixel region, creating a spatial buffer zone between the color filter layer and the joining member. This dimensional extension resolves the conflict by maintaining manufacturing simplicity while reducing optical interference through increased separation distance.
3Reliability
If the color filter layer extends beyond the effective pixel region, then joining reliability is improved, but device complexity increases
Solution Approach 1:
The color filter layer serves dual functions: maintaining its optical filtering role within the effective pixel region and acting as a structural element that prevents delamination by extending beyond this region. This multi-functionality achieves improved joining reliability without adding separate structural components, thereby avoiding increased device complexity.
Data Source
AI summary
A semiconductor apparatus according to an embodiment of the present disclosure, in a plan view with respect to the primary face of a semiconductor device, includes at least a part of an outer edge of a color filter layer being located between an effective pixel region and a joining member, and the distance from the effective pixel region to at least a part of the outer edge is greater than the distance from the color filter layer to a light transmission plate in the effective pixel region.