Color Filter Sealing Layer for High-Temperature Imaging Fabrication
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Solution Overview
Problem
Imaging apparatuses face challenges in enhancing the heat resistance of color filters to withstand high-temperature heat treatments, which can degrade the filters and affect image quality.
Innovation Solution
Incorporating a first sealing material with thermal conductivity of 0.5 W/m·K or less on the color filter, allowing it to transmit specific wavelength bands of light, thereby reducing thermal conduction and protecting the color filter during high-temperature treatments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If heat treatment at high temperature is performed after color filter formation, then manufacturing process flexibility is improved, but color filter degradation occurs
Solution Approach 1:
A sealing material layer is introduced as an intermediary between the color filter and the external environment. This sealing material has low thermal conductivity (0.5 W/m·K or less) to block heat transmission to the color filter during subsequent high-temperature manufacturing processes, while being transparent to light in the visible wavelength range to maintain optical performance.
Solution Approach 2:
The thermal conductivity parameter of the sealing material is specifically controlled to be 0.5 W/m·K or less, creating a thermal barrier that protects the color filter from high-temperature damage during manufacturing processes such as encapsulation or passivation layer formation.
2Reliability
If thermal conductivity of sealing material is reduced to protect color filter, then heat resistance is improved, but heat dissipation capability deteriorates
Solution Approach 1:
The sealing material is positioned specifically adjacent to the color filter where thermal protection is most critical. The low thermal conductivity property is localized to this specific region where the color filter requires protection, while other parts of the device can maintain normal heat dissipation pathways.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively enhances the heat resistance of the color filter, preventing degradation during heat treatments while maintaining light transmission, thus improving the imaging apparatus's performance and longevity.
Implementation Method 1
the first sealing material includes a material capable of transmitting light of a wavelength band set in advance
Implementation Method 2
the first sealing material suppresses thermal conduction to the color filter even in a case where heat treatment at high temperature is performed after the first sealing material is formed
Data Source
AI summary
Provided is an imaging apparatus capable of enhancing heat resistance of a color filter and a manufacturing method of the imaging apparatus. An imaging apparatus includes a semiconductor substrate, a color filter provided on one surface side of the semiconductor substrate, and a first sealing material provided on the one surface side, the first sealing material that covers the color filter. The first sealing material includes a material capable of transmitting light of a wavelength band set in advance and having a thermal conductivity of 0.5 W/m·K or less.