Color Filter Substrate Bonding Line Relocation for Narrow Bezel
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Liquid crystal display (LCD) devices have a wide bezel due to complex and space-consuming layouts of gate and data lines on the array substrate, which are necessary for high resolution, making the size of the array substrate larger than the color filter substrate.
Innovation Solution
The display device arranges bonding lines within the peripheral black matrix region or process reserved blank region of the color filter substrate, eliminating the need for them on the array substrate, and uses a connection structure like metal balls in a sealant to transmit signals, allowing full utilization of the color filter substrate regions and reducing bezel width.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a large number of gate lines and data lines are provided in the display region to achieve high resolution, then the resolution is improved, but the space occupied by the lines in the peripheral wiring region increases and the layout becomes complex
Solution Approach 1:
The bonding lines are moved from the array substrate to the color filter substrate, utilizing the peripheral black matrix region and process reserved blank region of the color filter substrate for signal transmission. This spatial relocation reduces the space requirements in the peripheral wiring region of the array substrate while maintaining high resolution display capabilities.
2Area of stationary object
If the array substrate size is increased to accommodate complex line layouts, then the wiring capacity is improved, but the bezel width increases
Solution Approach 1:
The bonding lines are extracted from the array substrate and relocated to the color filter substrate. This extraction reduces the space requirements on the array substrate, allowing for a smaller array substrate size and consequently a narrower bezel while maintaining all necessary wiring functions.
3Reliability
If bonding lines are arranged on the array substrate to transmit signals, then the signal transmission function is achieved, but the device complexity and manufacturing difficulty increase
Solution Approach 1:
Instead of placing bonding lines on the array substrate as is conventional, the patent inverts the approach by placing them on the color filter substrate. This inversion simplifies the array substrate layout and reduces manufacturing complexity while maintaining signal transmission functionality through the peripheral black matrix region and process reserved blank region.
Data Source
Figure 1~2
Figure 3~4
AI summary
A display device is disclosed and includes an array substrate and a color filter substrate. The color filter substrate includes a display region, a peripheral black matrix region and a process reserved blank region which are sequentially arranged from inside to outside. A bonding line is provided within the peripheral black matrix region and/or the process reserved blank region and electrically connected to a structure to be bonded on the array substrate through a connection structure.