Color Filter Substrate Fabrication Removing Top Layer
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Solution Overview
Problem
Conventional methods for fabricating color filter substrates result in poor light transmittance and light usage due to uneven surfaces caused by variations in chemical affinity between materials, which are attempted to be addressed by planarizing processes but lead to additional side effects.
Innovation Solution
A method involving the formation of a dry film with a top and bottom layer on a substrate, followed by a patterning process to create banks and openings, and the removal of the top layer after disposing color filter material, which improves light transmittance and usage by simplifying the fabrication process and enhancing optical properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a passivation layer is disposed over the color filter material to planarize the surface, then the surface uniformity is improved, but the light transmittance and light usage deteriorate
Solution Approach 1:
The invention extracts and removes the problematic passivation layer from the color filter substrate structure. By eliminating this layer that causes light absorption and scattering, the patent achieves both good surface uniformity through alternative planarization methods and improved light transmittance by removing the harmful intermediate layer.
Solution Approach 2:
The patent segments the fabrication process into distinct stages: forming the color filter material directly on the substrate, then applying a separate planarization layer only where needed for surface uniformity, rather than using a continuous passivation layer that compromises optical properties.
2Reliability
If multiple deposition and photo-etching processes are performed to fabricate thin film transistors and color filters, then the device functionality is improved, but the manufacturing complexity increases
Solution Approach 1:
The invention merges the color filter fabrication process with the TFT manufacturing process by using the same deposition and photo-etching equipment and methodologies. This integration reduces the total number of separate process steps while maintaining the functionality of both components.
Solution Approach 2:
The patent employs universal process techniques that serve multiple functions: the deposition processes create both TFT electrodes and color filter layers, while photo-etching patterns both the transistor structures and the color filter banks, reducing the need for dedicated process lines.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively improves light transmittance and usage by eliminating the need for planarizing processes on inorganic films, resulting in a more uniform and durable color filter substrate with enhanced optical properties.
Implementation Method 1
performing a patterning process on the dry film to form a patterned dry film having a plurality of banks and openings
Implementation Method 2
an ink jet process is performed to utilize a print head to dispose a color filter material into each of the openings
Data Source
AI summary
A method for fabricating color filters includes: providing a substrate; forming a dry film having a top layer and a bottom layer on the substrate; performing a patterning process on the dry film to form a patterned dry film having a plurality of banks and openings, wherein each of the openings is located between two adjacent banks; disposing at least one color filter material in each of the openings; and removing the top layer of the dry film.