Color Filter Touch Sensing Substrate Integration
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Solution Overview
Problem
Conventional touch display panels have issues with weight, cost, size, and low transmittance due to the separate fabrication and assembly of touch and display panels, and the capacitive sensing layer's limited design variability and sensitivity.
Innovation Solution
Integrating touch-sensing structures into the inner side of the color filter substrate, using a method that involves forming transparent conductive layers and assistant electrodes on a transparent substrate, with patterned sensing pads and assistant electrodes to reduce equivalent resistance and enhance sensitivity, and incorporating a black matrix to isolate and cover these elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the capacitive sensing layer is disposed at the outer side of the glass substrate, then the structure has high hardness and high stability, but the designing variety is limited and the thickness cannot be thinned
Solution Approach 1:
The patent inverts the conventional arrangement by moving the capacitive sensing layer from the outer side to the inner side of the glass substrate. This inversion allows the sensing layer to be positioned between the glass substrate and the color filter layer, enabling both thinning of the glass substrate and enhanced designing variety while maintaining structural stability through the glass substrate's inherent hardness.
Solution Approach 2:
The patent changes the dimensional arrangement by repositioning the capacitive sensing layer along the thickness dimension of the substrate. Instead of being on the outer surface, it is embedded within the substrate structure at a different depth position, which enables thinning of the overall panel thickness while preserving the sensing function and improving design flexibility.
2Length of moving object
If the glass substrate thickness is reduced, then the panel size is reduced, but the structural strength and stability may be compromised
Solution Approach 1:
The patent provides beforehand cushioning by embedding the capacitive sensing layer within the glass substrate structure before final assembly. This internal positioning of the sensing layer reinforces the substrate structure, allowing for thinning of the glass substrate while maintaining adequate structural strength through the distributed reinforcement of the embedded sensing elements.
3Reliability
If the capacitive sensing layer is made of high hardness materials, then the structure has high stability, but the touch sensitivity is reduced
Solution Approach 1:
The patent applies local quality by using different materials with appropriate properties for different functional requirements. The glass substrate maintains high hardness for structural stability, while the capacitive sensing layer uses materials optimized for touch sensitivity. This localized material selection allows each component to perform its specific function optimally without compromising the other.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach increases the reliability and material variety of the display panel, simplifies the fabrication process, and allows for thinning to reduce panel size while improving touch sensitivity.
Implementation Method 1
The liquid crystal molecules of the liquid crystal layer 40 will twist and rotate due to an electric field so as to alter the polarization direction of light
Data Source
AI summary
A method of forming a color filter touch sensing substrate integrates touch-sensing structures/elements of a touch panel into the inner side of the color filter substrate, which faces a thin film transistor substrate, and forms patterned assistant electrodes on the surfaces of the transparent sensing pads for decreasing the equivalent resistance of the touch-sensing structures/elements. Moreover, since an adjacent transparent conductive layer and an assistant electrode layer are patterned to form the transparent sensing pads and the patterned assistant electrodes, a simplified pattern-transferring process can be applied to the transparent sensing pads and the patterned assistant electrodes, or bridge structures can be formed from the assistant electrode layer for electrically connecting between some transparent sensing pads. Therefore, the forming process is simplified.