Color Resist Width Variation for High-Resolution Display Adhesion
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Solution Overview
Problem
The challenge in developing display devices with high resolution is the severe material requirements and manufacturing limitations due to the continuous reduction in pixel sizes, which affects image quality and manufacturing yields.
Innovation Solution
The proposed electronic device includes a black matrix layer with pixel and shielding regions, scan lines, and color resists. The color resists in the shielding regions have a wider width than the pixel resists, ensuring complete exposure and reaction during photolithography, thereby improving adhesion and reducing peeling probabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the sizes of the pixels are continuously reduced to improve resolution, then the image quality is improved, but the manufacturing precision and material requirements become more severe
Solution Approach 1:
The patent applies different width specifications to color resists in different regions: pixel region color resists have a first width, while shielding region color resists have a second width that is greater than the first width. This local differentiation allows the shielding region color resists to ensure complete exposure and reaction during photolithography, improving adhesion and reducing peeling, while maintaining the reduced pixel sizes for high resolution.
2Measurement precision
If the sizes of the pixels are continuously reduced to improve resolution, then the image quality is improved, but the manufacturing yield decreases
Solution Approach 1:
The patent differentiates the width of color resists based on their functional regions. The shielding region color resists are designed with a greater width to ensure complete exposure and reaction during photolithography, which improves adhesion and reduces peeling defects. This localized enhancement in critical areas improves manufacturing yield without requiring an increase in overall pixel size, thus maintaining high resolution.
3Reliability
If the width of color resists in shielding regions is increased to ensure complete exposure and reaction, then the adhesion is improved, but the device complexity increases
Solution Approach 1:
The patent specifies that pixel region color resists have a first width while shielding region color resists have a second width greater than the first width. This localized differentiation ensures complete exposure and reaction in the shielding region, improving adhesion and reducing peeling. The complexity increase is minimal and localized only to the shielding region, while the pixel region maintains its original design for high resolution.
Solution Approach 2:
The patent divides the color resist structure into two segments: pixel region color resists and shielding region color resists, each with different width specifications. This segmentation allows independent optimization of each region - the pixel region for resolution and the shielding region for adhesion - without compromising either function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the adhesion of the color resists, reduces the likelihood of peeling, and ensures complete reaction during the photolithography process, thereby improving the overall quality and reliability of high-resolution display devices.
Implementation Method 1
ensuring complete exposure and reaction during photolithography
Data Source
AI summary
An electronic device includes: a first substrate; a second substrate opposite to the first substrate; a black matrix layer disposed between the first and second substrates and including a first pixel region and a first shielding region arranged along a first direction, wherein the first pixel region includes first and sub-pixel openings arranged along a second direction different from the first direction; a scan line disposed between the first and second substrates and extending along the second direction, wherein the first shielding region overlaps the scan line; a first and second color resist disposed in the first shielding region and are overlapped to form an overlapping region, wherein the overlapping region and the black matrix layer are overlapped; and first and second pixel color resists respectively disposed corresponding to the first and second sub-pixel openings.