Colored Resin Mask Sublimation for Selective Plating
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Solution Overview
Problem
Existing methods for selectively applying plating to base materials face challenges such as the difficulty in inspecting pattern shapes and the occurrence of sagging or carbon deposits due to the use of transparent organic resists and the need for organic solvents and specialized equipment, which hinder efficient and accurate manufacturing in ornaments, wristwatch belts, semiconductor devices, and printed circuit boards.
Innovation Solution
A method involving the formation of a resin layer as a mask on the base material, where the resin layer is selectively removed through sublimation by heating, using infrared radiation, such as a laser beam, to avoid the need for organic solvents and specialized equipment, and to enhance patterning accuracy and defect detection with fluorescence properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a transparent organic resist is used for selective plating, then plating can be applied to specific patterns, but it becomes difficult to inspect pattern shapes and pinholes
Solution Approach 1:
The patent applies a colored resist (yellow or green) instead of a transparent resist, enabling visual inspection of pattern shapes and pinholes while maintaining patterning accuracy. The color provides contrast against the base material surface, making defects detectable without compromising the resist's masking function during plating.
2Loss of substance
If pyrolysis is used to remove the resist, then the resist can be eliminated, but sagging pattern shape and carbon deposits occur due to melting and heat
Solution Approach 1:
The patent employs sublimation instead of pyrolysis for resist removal. The colored resist undergoes phase transition from solid to gas directly without melting, eliminating sagging and carbon deposit formation. This phase change process occurs at controlled temperatures that prevent thermal degradation of the pattern shape while completely removing the resist material.
Solution Approach 2:
The patent replaces the thermal decomposition mechanism (pyrolysis) with a phase transition mechanism (sublimation). By using infrared irradiation to induce sublimation rather than combustion, the process avoids the harmful effects of high-temperature decomposition while achieving complete resist removal.
3Loss of substance
If conventional resist removal methods are used, then the resist can be removed, but organic solvents and specialized equipment are required, constraining efficient manufacturing
Solution Approach 1:
The patent replaces chemical removal methods (organic solvents) and complex thermal decomposition equipment with a simple infrared irradiation system. The sublimation process uses infrared heating which can be implemented with standard industrial heating equipment, eliminating the need for specialized resist removal machinery and chemical handling infrastructure.
Solution Approach 2:
The patent extracts the resist removal process from the complex chemical treatment sequence by using direct thermal sublimation. This separates the removal function from chemical solvents and specialized equipment, allowing resist elimination through a standalone thermal process that can be integrated into existing manufacturing lines without additional complex systems.
4Area of stationary object
If high molecular weight photosensitive resin is used for photoresist, then the resist provides adequate coverage, but sagging and carbon deposits occur during pyrolytic removal
Solution Approach 1:
The patent uses a colored resist formulation that undergoes clean sublimation phase transition instead of pyrolytic decomposition. This allows the use of adequate resist thickness for complete coverage while avoiding the sagging and carbonization that occur when high molecular weight resins are subjected to high-temperature pyrolysis. The sublimation process occurs at lower temperatures that maintain pattern integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for more efficient and selective plating application without the constraints of organic solvents and equipment, improves patterning accuracy by preventing sagging and carbon deposits, and enhances defect detection, leading to improved yield rates and aesthetic quality.
Implementation Method 1
a part of the resin layer is sublimed by heating to be removed
Implementation Method 2
the resin layer is partially heated by being irradiated with infrared ray in the patterning
Implementation Method 3
the resin layer has fluorescence properties. According to this, the fluorescence of the resin layer makes it easy to detect defects in the resin layer
Data Source
AI summary
A method for forming a pattern in which a plating layer is selectively formed on a base material using a resin layer as a mask, includes resin layer-forming in which the resin layer is formed on the base material; and patterning in which the resin layer is selectively removed, in which in the patterning, a part of the resin layer is sublimed by heating to be removed.