Columnar Conductor Shielding Between ICs and Passive Elements

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Solution Overview

Problem

Existing electronic devices face challenges in effectively suppressing electromagnetic interference between integrated circuits and passive elements, leading to reduced operational reliability.

Innovation Solution

The electronic device incorporates a columnar conductor disposed between integrated circuits and passive elements, acting as an electromagnetic shield to prevent noise propagation and interference, enhancing operational reliability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If electronic components are densely arranged to improve integration, then device functionality increases, but electromagnetic interference between components worsens

Engineering Contradiction:
Improvedevice functionalityVSAvoidelectromagnetic interference
Core Design Contradiction:
Adaptability or versatilityVSObject-affected harmful factors

Solution Approach 1:

A columnar conductor is introduced as an intermediary element positioned between adjacent electronic components. This conductor acts as a shield that intercepts and redirects electromagnetic fields, preventing direct interference between components while allowing the components to maintain their functional integrity and dense arrangement.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The columnar conductor provides localized electromagnetic shielding precisely where interference occurs between adjacent components. Rather than requiring comprehensive shielding of the entire device, the shield is strategically placed only in the critical interference zones, maintaining functionality while reducing interference locally.

Inventive Principle:
Principle #3Local quality

2Reliability

If shielding structures are added to suppress electromagnetic interference, then operational reliability improves, but device complexity increases

Engineering Contradiction:
Improveoperational reliabilityVSAvoiddevice complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The shielding function is segmented into discrete columnar conductors positioned between specific components rather than using a continuous shielding structure. This segmentation reduces the overall amount of shielding material and simplifies the device architecture while still providing effective interference suppression at critical locations.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The columnar conductor acts as a thin, minimal-structure shield that provides effective electromagnetic interference suppression without adding significant bulk or complexity to the device. The simple columnar geometry is easier to manufacture and integrate than complex continuous shielding structures.

Inventive Principle:
Principle #30Flexible shells and thin films

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The configuration effectively suppresses electromagnetic interference, improving the operational reliability of the device by shielding integrated circuits from external noise and reducing mutual interference between components.

Implementation Method 1

a columnar conductor disposed between integrated circuits and passive elements, acting as an electromagnetic shield to prevent noise propagation and interference

Methodology Applied
Scientific EffectElectromagnetic shielding: Faraday Cage

Data Source

PatentUS20260005157A1Electronic device
Publication Date: 2026.01.01 ROHM CO LTD
  • US20260005157A1 patent drawing
  • US20260005157A1 patent drawing
  • US20260005157A1 patent drawing

AI summary

An electronic device comprises a first electronic component, a support member including a support surface supporting the first electronic component, a columnar conductor disposed in a direction where the support surface faces with respect to the support member, and a sealing resin formed on the support surface and covering the first electronic component. The columnar conductor includes a conductor top surface facing the same side as the support surface in a thickness direction of the support member. The conductor top surface is covered with the sealing resin.