Uniform Insulating Layer Formation Using Columnar Conductor Stoppers
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Solution Overview
Problem
Existing methods for manufacturing electronic parts with multilayer structures face challenges in achieving uniform thickness of insulating layers and efficient resin usage, leading to potential deformation and unevenness due to external forces and resin undulation.
Innovation Solution
A method involving a substrate sheet with a projecting portion outside the part formation area to increase resin flow resistance, allowing for precise computation and application of the minimum necessary resin amount to achieve uniform thickness, using pressure and heat to form the insulating layer with the conductor portions acting as stoppers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If resin is applied by spin coating to cover conductor portions, then the insulating layer is formed, but the overall thickness becomes non-uniform due to surface undulation
Solution Approach 1:
The patent applies a release film to the insulating resin before spin coating. This preliminary action prevents the resin from adhering to the conductor portions, allowing it to flow smoothly over the surface and fill in undulations, thereby achieving uniform thickness despite the presence of conductor portions with varying heights
2Reliability
If conductor portions are formed by plating or etching on insulating layer, then electrical connections are created, but surface undulation occurs making thickness control difficult
Solution Approach 1:
The release film serves as an intermediary between the insulating resin and the conductor portions. It allows the resin to be applied without adhering to the conductor surfaces, enabling uniform coating thickness while maintaining the electrical functionality of the conductor portions formed by plating or etching
3Strength
If external force is applied during pressing process, then layers are bonded, but deformation occurs on the insulating layer surface
Solution Approach 1:
The release film acts as a mediator during the pressing process, distributing the external force uniformly across the insulating layer surface. This prevents localized deformation while still achieving strong bonding between layers, as the force is transmitted through the flexible release film rather than concentrating at specific points
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures uniform thickness of the insulating layer, reduces resin consumption, and minimizes the risk of deformation or detachment between layers, while simplifying the manufacturing process and enabling the production of multiple electronic parts.
Implementation Method 1
covering said wiring pattern with said resin by applying pressure and heat to said insulating sheet
Implementation Method 2
covering said wiring pattern with said resin by applying pressure and heat to said insulating sheet
Data Source
AI summary
An insulating sheet including resin is attached to a conductor portion composed of a wiring pattern and a columnar conductor from above. Then pressure and heat are applied to the insulating sheet using the columnar conductor as a stopper to form a layer of resin having a uniform thickness with the height of the columnar conductor being a reference to cover the conductor portion. In such method for manufacturing an electronic part, a projecting portion is formed outside a part formation area. In this substrate sheet, the amount of the resin required for forming the layer is computed based on the proportion of the volume taken up by the conductor portion in a domain including the projecting portion, and the thickness of the insulating sheet is set in accordance with the computed resin amount.