Columnar Electrode Pad Anchoring to Prevent Metal Layer Peeling

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Solution Overview

Problem

Semiconductor packages face challenges in achieving high connection reliability for electrode pads due to issues like peeling of metal layers and irregularities from grinding marks and machining regions, which affect the stability and reliability of electrical connections.

Innovation Solution

The semiconductor device incorporates a columnar electrode with a depression and a member that overlaps the exposed metal layer to anchor the electrode pad, enhancing its strength and reliability by fixing the metal layer and preventing peeling, while also removing irregularities through etching and forming a depression to improve the interface with the columnar electrode.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a metal layer is formed on the columnar electrode to ensure electrical connection, then electrical conductivity is improved, but the metal layer may peel off reducing connection reliability

Engineering Contradiction:

Improveconnection reliabilityVSAvoidmetal layer adhesion

Core Design Contradiction:

ReliabilityVSStrength

Solution Approach 1:

The patent applies preliminary action by forming a depression on the columnar electrode surface before depositing the metal layer. This pre-prepared surface structure with increased surface area and mechanical interlocking features ensures better adhesion of the subsequent metal layer, preventing peeling while maintaining electrical conductivity.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The depression creates local quality variation on the columnar electrode surface, with the recessed area providing enhanced mechanical anchoring for the metal layer while the overall cylindrical structure maintains its electrical function. This localized modification improves adhesion without compromising the electrode's primary electrical conductivity.

Inventive Principle:

Principle #3Local quality

2Manufacturing precision

If grinding is performed on the columnar electrode to remove irregularities, then surface quality is improved, but grinding marks and machining regions remain affecting reliability

Engineering Contradiction:

Improvesurface qualityVSAvoidconnection stability

Core Design Contradiction:

Manufacturing precisionVSReliability

Solution Approach 1:

The patent converts the harmful effect of surface irregularities into a beneficial feature by intentionally forming a depression that incorporates and masks residual grinding marks and machining regions. The depression structure transforms surface defects into a controlled geometric feature that provides mechanical anchoring while isolating the harmful irregularities from the metal layer interface.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

3Ease of manufacture

If the electrode pad interface is simplified for ease of manufacture, then manufacturing complexity is reduced, but connection reliability deteriorates due to lack of anchoring

Engineering Contradiction:

Improveelectrode pad fabricationVSAvoidelectrode pad connection

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The depression is formed on the columnar electrode before the electrode pad is attached, creating a pre-prepared anchoring structure. This preliminary action allows the electrode pad to be simply placed and bonded onto the depressed surface, maintaining ease of manufacture while the depression provides the necessary mechanical interlocking for reliable connection.

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration significantly improves the connection reliability of the electrode pad by providing an anchor effect, removing grinding marks and machining influences, and stabilizing the metal layer, resulting in enhanced electrical connectivity and package stability.

Implementation Method 1

The columnar electrode penetrates the insulation member in a direction approximately perpendicular to the first face

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 2

a first metal layer of at least one layer which covers an outer circumference of the columnar electrode member

Methodology Applied

Scientific EffectAdhesion: Adhesive

Data Source

PatentUS20230411330A1Semiconductor device and manufacturing method thereof

Publication Date: 2023.12.21 KIOXIA CORP

AI summary

A semiconductor device according to the present embodiment includes an insulation member, a columnar electrode, a member, and an electrode pad. The insulation member has a first face. The columnar electrode penetrates the insulation member in a direction approximately perpendicular to the first face. The columnar electrode has a columnar electrode member and a first metal layer of at least one layer which covers an outer circumference of the columnar electrode member and which extends until becoming exposed from the first face. The member is provided on the first face and is arranged so as to overlap with at least a part of the first metal layer that is exposed from the first face as viewed from a direction approximately perpendicular to the first face. The electrode pad is provided on the first face so as to cover the member and is electrically connected to the columnar electrode member.