Columnar Electrode Via Layout for Stronger Electronic Components
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Solution Overview
Problem
Conventional electronic components face limitations in design flexibility due to the placement of via conductors, which affects the bonding strength and arrangement of internal electrodes, restricting the improvement of component performance.
Innovation Solution
An electronic component design featuring a via conductor that penetrates the element body with one end surface flush with the outer surface and a columnar electrode protruding in the thickness direction, allowing for increased freedom in the arrangement of internal electrodes and improved bonding strength, along with a manufacturing method involving conductive pastes and resin sheets to form the component.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the via conductor is provided closer to the central portion from the end portion of the element body to suppress decrease in bonding strength, then the bonding strength between planar electrode and via conductor is improved, but the degree of freedom of arrangement of other via conductors and internal electrodes is limited
Solution Approach 1:
The invention inverts the conventional approach by making the columnar electrode protrude outward from the end surface of the element body rather than being entirely contained within. This inversion allows the via conductor to be positioned at the outer edge while maintaining bonding strength, as the columnar electrode extends outward to provide a stable bonding surface away from the irregular via conductor surface.
Solution Approach 2:
The invention transitions from a two-dimensional planar electrode configuration to a three-dimensional columnar electrode structure that protrudes in the thickness direction. This dimensional change enables the electrode to extend beyond the element body surface, allowing the via conductor to be positioned at the outer edge while maintaining adequate bonding distance and stability.
2Adaptability or versatility
If the planar electrode is provided at the end portion of the element body to improve design flexibility, then the degree of freedom of arrangement is improved, but the bonding strength decreases due to non-adhesion of plating or voids at the interface
Solution Approach 1:
Instead of positioning the electrode within the element body and risking bonding issues at the via conductor interface, the invention inverts the structure by having the columnar electrode protrude outward. This ensures the bonding interface is formed away from the problematic via conductor region, eliminating non-adhesion and void formation while maintaining design flexibility.
Solution Approach 2:
The columnar electrode acts as an intermediary structure that connects the via conductor inside the element body to the external circuit board. By extending outward, it provides a stable intermediate bonding surface that is separated from the via conductor, preventing direct contact and associated bonding problems while maintaining electrical connection.
3Adaptability or versatility
If the via conductor is positioned at the outer edge portion to increase degree of freedom of arrangement, then the adaptability is improved, but irregularities on the front surface cause non-adhesion of plating and voids at the interface
Solution Approach 1:
The invention inverts the conventional arrangement by having the columnar electrode protrude outward from the end surface rather than being contained within. This allows the via conductor to be positioned at the outer edge for design flexibility while the columnar electrode provides a clean, regular bonding surface away from the via conductor irregularities.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the degree of freedom in arranging via conductors and internal electrodes, facilitating improved performance and reducing the risk of the columnar electrode turning up, while allowing for higher frequency operation and increased connection strength.
Implementation Method 1
a firing step of firing the laminate to burn out the resin sheet, forming, as an element body, a portion of the not-burned-out sheet, and forming, as a columnar electrode, the second conductive paste filled in the second hole portion of the burned-out resin sheet
Data Source
AI summary
To provide electronic component that can be easily designed for improving performance of electronic component by increasing a degree of freedom of arrangement of via conductor and internal electrode inside electronic component, method for manufacturing electronic component, and circuit module. Electronic component according to the present disclosure includes element body having outer surface, via conductor configured to penetrate at least a part of element body in a thickness direction of element body, via conductor provided so that one end surface is flush with outer surface of element body, and columnar electrode having base end portion electrically connected to one end surface of via conductor, so as to protrude in thickness direction from outer surface of element body. A length in thickness direction of columnar electrode is longer than maximum width in cross section orthogonal to thickness direction of columnar electrode.