Comb-Lead Semiconductor Package for Heat Dissipation
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Solution Overview
Problem
Existing semiconductor devices using III-V group nitride semiconductors face challenges in efficiently dissipating heat and maintaining electrical connectivity, which can affect performance and reliability.
Innovation Solution
The semiconductor device incorporates a heat dissipation member and a lead structure with specific configurations, including comb-shaped portions and conductive bonding, to enhance heat dissipation and electrical connectivity, using materials like copper and nickel for leads and a sealing resin for insulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional lead structure is used in the semiconductor device, then the device complexity is reduced, but the heat dissipation efficiency deteriorates
Solution Approach 1:
The lead structure is segmented into multiple comb-shaped portions with alternating fingers, creating a distributed heat dissipation network throughout the device rather than relying on a single heat path. This segmentation allows heat to be dissipated across multiple contact points with the heat dissipation member.
Solution Approach 2:
The lead structure transitions from a simple linear configuration to a three-dimensional comb-shaped arrangement that extends in multiple directions. This dimensional change increases the surface area for heat transfer and creates multiple thermal pathways from the semiconductor element to the heat dissipation member.
2Reliability
If the first face is positioned closer to the semiconductor element, then the electrical connectivity is improved, but the heat dissipation distance is reduced
Solution Approach 1:
The comb-shaped lead structure creates multiple segmented contact points with the semiconductor element through its alternating fingers. This segmentation provides redundant electrical connection paths, improving reliability while the extended structure maintains adequate heat dissipation distance through the distributed geometry.
Solution Approach 2:
The comb-shaped portions are nested within the sealing resin structure, with the first faces positioned to optimally contact the semiconductor element while the overall lead structure extends toward the heat dissipation member. This nested arrangement allows simultaneous optimization of electrical connectivity and thermal management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively dissipates heat and maintains robust electrical connections, improving the performance and reliability of the semiconductor device.
Implementation Method 1
a heat dissipation member, wherein the semiconductor element is mounted on the first side in the thickness direction of the island lead
Implementation Method 2
the first lead includes a first comb portion bonded to the first electrode and including a first face facing the first side in the thickness direction
Implementation Method 3
The semiconductor device incorporates a heat dissipation member and a lead structure with specific configurations, including comb-shaped portions and conductive bonding
Implementation Method 4
using materials like copper and nickel for leads and a sealing resin for insulation
Data Source
AI summary
A semiconductor device includes leads, a semiconductor element, a sealing resin covering the semiconductor element, and a heat dissipator. The semiconductor element includes first and second electrodes on a first side in a thickness direction. The leads include a first lead, a second lead, and an island lead. The semiconductor element is mounted on the first side in the thickness direction of the island lead. The first lead includes a first comb portion bonded to the first electrode and including a first face facing the first side in the thickness direction. The second lead includes a second comb portion bonded to the second electrode and including a second face facing the first side in the thickness direction. The first face is located on the first side in the thickness direction from the second face. The heat dissipator is bonded to the first face and exposed from the sealing resin.