Comb-Shape Heat Dissipation Device for Memory Modules
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Solution Overview
Problem
There is a lack of effective heat dissipation devices specifically designed for memory modules on motherboards, particularly in servers that generate significant heat due to high data processing demands.
Innovation Solution
A heat dissipation device comprising a heat dissipation piece, heat conduction plates arranged in a comb shape, a rod piece, and a switch, where the rod piece moves through holes in the heat conduction plates, allowing for tight contact and heat transfer when the switch is in the on-state, and easy removal when in the off-state, to accommodate and cool memory modules.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat conduction plates are used to conduct heat away from memory modules, then heat dissipation efficiency is improved, but the device complexity increases due to the need for additional components like rod pieces and switches
Solution Approach 1:
The heat dissipation device is segmented into multiple heat conduction plates arranged in a comb shape, with each plate independently connected to the heat dissipation piece. This segmentation allows heat to be conducted away from multiple sides of the memory modules simultaneously, improving heat dissipation efficiency while keeping each individual plate simple in structure
Solution Approach 2:
The rod piece is designed to penetrate through holes in the heat conduction plates, with the limitation portion nesting within the structure to press against the plates. This nested design allows the limiting function to be integrated within the existing heat conduction structure rather than requiring separate external components
2Temperature
If the heat conduction plates are designed to tightly contact memory modules for effective heat transfer, then heat dissipation performance is improved, but the ease of operation deteriorates because modules become difficult to remove
Solution Approach 1:
The rod piece is designed to be movable relative to the heat conduction plates, allowing it to shift position when the switch is actuated. This dynamic design enables the limitation portion to move between a pressing position (for tight contact and heat transfer) and a retracted position (for easy module removal), resolving the contradiction between heat transfer efficiency and ease of operation
Solution Approach 2:
The rod piece acts as an intermediary mechanism between the switch and the heat conduction plates. When the switch is pivoted, it drives the rod piece to move, which in turn causes the limitation portion to press against or separate from the heat conduction plates. This intermediary design allows indirect control of the contact state, improving ease of operation while maintaining effective heat transfer when needed
3Adaptability or versatility
If multiple heat conduction plates are arranged parallel to each other to accommodate multiple memory modules, then the adaptability is improved, but the device complexity increases due to the comb shape structure
Solution Approach 1:
The comb-shaped arrangement of multiple heat conduction plates creates a universal structure that can accommodate multiple memory modules of the same type simultaneously. Each plate serves the same heat conduction function for different modules, providing adaptability and versatility while using a repeating, standardized pattern that limits structural complexity
Solution Approach 2:
Multiple heat conduction plates are merged into a single comb-shaped assembly that functions as one integrated heat dissipation unit. All plates are connected to the same heat dissipation piece, combining their heat conduction functions into a unified structure that provides adaptability for multiple modules without requiring separate complex assemblies for each
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively reduces the temperature rise of memory modules by conducting heat away through the heat conduction plates and allows for easy installation and removal of modules, enhancing operational efficiency and reliability.
Implementation Method 1
heat generated by the memory modules can be conducted to the heat dissipation piece through the heat conduction plates, thereby reducing the rate of temperature rise of the memory modules
Data Source
AI summary
A heat dissipation device includes a heat dissipation piece, heat conduction plates, a rod piece and a switch. The heat conduction plates are connected to the heat dissipation piece and spaced apart from and arranged parallel to each other so as to define accommodating spaces. Each heat conduction plate has a free end away from the heat dissipation piece, and the free end has a through hole. The rod piece has a first end and a second end opposite to each other, the rod piece penetrates through the through holes, and the second end has a limitation portion. The switch has a cam portion pivoted to the first end. When the switch is pivoted with respect to the heat conduction plates, the cam portion drives the rod piece to move among the through holes, making the limitation portion to press against or be separated from the heat conduction plates.