Combined Circuit Module for Compact Image Displays
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Solution Overview
Problem
Flexible printed circuit boards in image displays face space constraints due to the width-wise occupation by circuit control chips, limiting the compactness of electronic devices.
Innovation Solution
A combined-type circuit carrying and controlling module is introduced, featuring a first circuit substrate with conductive penetration bodies that connect to a control substrate with a circuit control chip, allowing the control substrate to be placed under the first circuit substrate and electrically connected through these penetration bodies, reducing the space required by the circuitry.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the circuit control chip is placed on the flexible printed circuit board in the width direction, then the electrical connection function is achieved, but the width of the device increases
Solution Approach 1:
The patent applies dimensionality change by transitioning the circuit control chip from a width-wise arrangement to a depth-wise arrangement. The chip is mounted on a separate rigid substrate that extends in the depth direction of the flexible printed circuit board, moving the circuit elements from the horizontal plane to the vertical plane. This spatial reconfiguration reduces the device width while maintaining all necessary electrical connection functions through conductive penetration bodies that establish vertical connections.
Solution Approach 2:
The patent segments the circuit system into two distinct parts: a flexible printed circuit board for signal routing and a separate rigid substrate for mounting the circuit control chip. This segmentation allows each component to be optimized independently - the flexible board maintains its bending capability while the rigid substrate provides stable chip mounting, resolving the conflict between functional integration and spatial efficiency.
2Adaptability or versatility
If the circuit control chip occupies width-wise space on the flexible printed circuit board, then the control function is achieved, but the compactness of electronic devices is reduced
Solution Approach 1:
The patent implements nesting by placing the rigid substrate containing the circuit control chip within the structural envelope of the flexible printed circuit board assembly. The rigid substrate is positioned such that it extends in the depth direction beneath or alongside the flexible board, allowing the control function to be nested within the existing device structure without increasing the overall width footprint, thereby maintaining device compactness.
3Area of stationary object
If the control substrate is positioned under the first circuit substrate through conductive penetration bodies, then the width space is reduced, but the manufacturing complexity increases
Solution Approach 1:
The patent introduces conductive penetration bodies as intermediary elements that facilitate the electrical connection between the first circuit substrate and the control substrate. These penetration bodies act as mediators that bridge the two substrates, enabling electrical connectivity while allowing the control substrate to be positioned in the depth direction. This intermediary approach simplifies the manufacturing process by providing a standardized connection mechanism rather than requiring direct substrate integration.
Data Source
AI summary
An image display and a combined-type circuit carrying and controlling module thereof are provided. The combined-type circuit carrying and controlling module includes a first circuit substrate structure, a control substrate structure, a second circuit substrate structure, an insulative connection structure and a conductive connection structure. The first circuit substrate structure includes a first carrier substrate, a first circuit layout layer and a plurality of first conductive penetration bodies. The control substrate structure includes a circuit substrate and a circuit control chip. The second circuit substrate structure includes a second carrier substrate and a second circuit layout layer. The insulative connection structure is connected between the first carrier substrate and the second carrier substrate. The conductive connection structure is electrically connected between the first circuit layout layer and the second circuit layout layer.