Combined Circuit Unit for Inkjet Printer Heat Dissipation
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Solution Overview
Problem
Inkjet printers face challenges in achieving high resolution while maintaining heat dissipation, leading to increased energy consumption and potential overheating of the driver IC, which affects ink discharge quality and printer size due to the need for large heat sinks and additional components.
Innovation Solution
A combined circuit unit integrating a flexible printed circuit film and a rigid printed circuit board with a heat dissipation region, allowing for efficient heat dissipation without the need for a separate heat sink, thereby miniaturizing the inkjet printer and stabilizing ink discharge.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the density of nozzles and individual electrodes is increased to achieve higher resolution, then the resolution is improved, but the heat release value generated by the driver IC increases
Solution Approach 1:
The patent combines the heat dissipation function with the circuit board structure by forming a heat dissipation region directly on the rigid printed circuit board. This merging of functions allows the circuit board to serve both as an electrical connection medium and as a heat dissipation component, eliminating the need for separate heat sink structures.
Solution Approach 2:
The rigid printed circuit board is designed to perform multiple functions: electrical connection through wiring patterns and terminals, structural support, and heat dissipation through the dedicated heat dissipation region. This multi-functionality reduces the overall component count and simplifies the inkjet head structure.
2Temperature
If a large-scale heat sink is provided to dissipate heat from the driver IC, then the heat dissipation capability is improved, but the size of the inkjet head increases
Solution Approach 1:
The heat dissipation function is merged into the rigid printed circuit board structure itself. The heat dissipation region is formed as an integral part of the circuit board, eliminating the need for separate heat sink components and reducing the overall inkjet head volume.
Solution Approach 2:
The heat dissipation function is extracted from the traditional separate heat sink component and integrated into the circuit board. This extraction and reintegration allows for more efficient space utilization and reduces the overall device size.
3Temperature
If an elastic member such as a sponge is used to push the driver IC to the heat sink, then the heat transfer is improved, but the volume required for the elastic member increases the inkjet head size
Solution Approach 1:
The heat transfer function is merged directly into the rigid printed circuit board through the heat dissipation region. The board itself provides the thermal conduction path from the driver IC to the external environment, eliminating the need for separate elastic member heat transfer components.
Solution Approach 2:
The rigid printed circuit board serves its own heat dissipation needs through the integrated heat dissipation region. The board structure itself provides the thermal management capability without requiring additional dedicated heat transfer components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables high heat dissipation capability and consistent ink discharge quality in a compact inkjet printer design, reducing energy consumption and eliminating the need for additional heat management components.
Implementation Method 1
When the driving voltage is applied to the selected individual electrode, the thickness of the piezoelectric sheet in the location that corresponds to the selected individual electrode changes by a so-called piezoelectric longitudinal effect.
Implementation Method 2
An actuator unit utilizing a piezoelectric sheet made from piezoelectric ceramics is used to apply pressure to any pressure chamber that may be arbitrarily selected from the pressure chambers.
Implementation Method 3
heat generated from the driver IC is transferred to the heat sink, and the heat is dissipated to the exterior (such as into the atmosphere)
Data Source
AI summary
A combined circuit unit is developed by combining a rigid printed circuit board and a flexible printed circuit film. The combined circuit unit is very compact in its shape, yet, maintains high cooling capability of an electronic circuit device. A driver IC that generates heat is mounted on the flexible printed circuit film. A heat dissipation region is formed within the rigid printed circuit board. The driver IC is wedged between the flexible printed circuit film and the rigid printed circuit board at the heat dissipation region. Heat generated by the driver IC is efficiently dissipated by the heat dissipation region to the exterior.