Lightweight Combined Grinding Wheel With Chip-Discharge Grooves
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Solution Overview
Problem
Brazed diamond grinding wheels face issues with grinding chip discharge and clogging, leading to reduced efficiency, sharpness loss, and a short service life due to diamond shedding and temperature increase.
Innovation Solution
A lightweight combined type grinding wheel design featuring a bottom plate and cover plate connected via an adapter, with bosses on the bottom plate supporting abrasive grains and chip grooves for chip discharge, and weight-reducing holes for reduced weight and improved material selection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If brazed diamond grinding wheels are used to achieve strong chemical metallurgical bond and high abrasive holding strength, then processing efficiency and sharpness are improved, but grinding chips are difficult to discharge and clogging occurs
Solution Approach 1:
The grinding wheel is divided into a bottom plate, cover plate, and multiple bosses, with chip grooves created between adjacent bosses. This segmentation allows grinding chips to be discharged through the grooves, preventing clogging while maintaining the brazed diamond structure for high processing efficiency.
2Reliability
If brazed diamond grinding wheels are used to achieve high matrix strength and long service life, then durability is improved, but diamond shedding increases with temperature and time causing the wheel to fail
Solution Approach 1:
The grinding wheel is segmented into a bottom plate, cover plate, and multiple bosses, allowing heat to be distributed and dissipated more effectively across the structure. This segmentation prevents localized overheating that causes diamond shedding, extending service life even under prolonged use.
Solution Approach 2:
The design extracts the abrasive function into replaceable bottom plates with bosses, separating the abrasive elements from the main wheel structure. This allows the abrasive components to be replaced when worn, while the main structure remains intact, effectively managing the temperature and wear issues.
3Strength
If traditional grinding wheel design is used to maintain structural integrity, then strength is improved, but overall weight is excessive
Solution Approach 1:
The cover plate is designed as a thin plate structure (3-6mm thickness) that provides structural integrity and containment while minimizing weight. This thin-film approach maintains the necessary strength to hold the diamond abrasives and contain chips during operation, while significantly reducing the overall weight of the grinding wheel.
Solution Approach 2:
The grinding wheel is segmented into multiple components (bottom plate, cover plate, bosses) that can be optimized independently. This segmentation allows the use of thinner materials and lighter-weight constructions while maintaining overall structural integrity through the modular design and detachable connections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances chip discharge and removal, maintains sharpness, reduces dust, and extends service life by allowing separate replacement of worn components, while achieving weight reduction and improved thermal resistance.
Implementation Method 1
Brazed diamond grinding wheels achieve a strong chemical metallurgical bond between the diamond and the steel matrix with the help of the brazing material
Data Source
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AI summary
The application relates to the technical field of grinding wheels. In order to overcome the defects of the grinding wheels in the art, e.g. the difficulty in chip removal and the short service life, the application provides a lightweight combined type grinding wheel, comprising a bottom plate, a cover plate and an adapter. The bottom plate and the cover plate are coaxially fitted and are fixed by the adapter. A plurality of bosses are formed on the surface of the bottom plate facing away from the cover plate. The plurality of bosses are evenly spaced around the axis of the bottom plate. Abrasive grains are laid on the top surface of each boss. The bosses are spaced from each other, and a chip groove is formed between two adjacent bosses. The chip groove is used to discharge the grinding chips generated by grinding. The application provides bosses and chip grooves on the cover plate, and lays diamond abrasive grains on the top surface of bosses by brazing, thereby improving the convenience of the grinding wheel in terms of chip storage and chip removal, and reducing the dust generated during grinding. In addition, when the abrasive grains are worn or fall off, the bottom plate can be replaced separately, so that the service life of the grinding wheel may be longer.