Combined Ultrasonic Grinding Wheel with Nested Vibration Layers

The grinding wheel is divided into multiple independent layers (first grinding wheel layer, second grinding wheel layer, third grinding wheel layer) with each layer having its own grinding surface. This segmentation allows multiple areas to participate in grinding simultaneously, significantly increasing the effective grinding area while maintaining structural independence and simplicity of each layer.

The patent employs a nested structure where the first, second, and third grinding wheel layers are arranged concentrically with the second layer inside the first and the third layer inside the second. This nesting approach maximizes the utilization of internal space, allowing the internal areas to participate in grinding while maintaining a compact overall structure.

The patent introduces multiple vibration modes (longitudinal vibration, radial vibration, and tangential vibration) that can be independently controlled and combined. This dynamic approach allows the system to adapt to different machining requirements by adjusting the vibration modes, thereby improving machining quality for hard and brittle materials while maintaining flexibility in the vibration control system.

The patent utilizes complex mechanical vibration patterns by combining longitudinal, radial, and tangential vibration modes in the grinding wheel layers. This multi-mode vibration approach enhances the removal effect on hard and brittle materials through the synergistic effect of different vibration directions, improving machining quality beyond what a single vibration mode can achieve.

The patent incorporates a porous or open structure design in the grinding wheel layers, particularly in the arrangement of the first, second, and third layers with gaps between them. This porous-like structure facilitates heat dissipation by allowing cooling fluid to circulate through the internal spaces and improves chip removal by providing escape paths for generated chips, while maintaining structural robustness through the layered construction.

The patent extracts heat and chips from the grinding area by designing open pathways between the grinding wheel layers. The gaps and spaces between the first, second, and third grinding wheel layers serve as extraction channels for heat (through fluid circulation) and chips (through physical ejection paths), effectively removing harmful byproducts while maintaining the structural integrity of the grinding wheel.

The grinding wheel is segmented into multiple functional layers (first, second, and third grinding wheel layers) where each layer contributes to the grinding process. This segmentation activates the previously unused internal areas, allowing multiple surfaces to participate in grinding simultaneously, thereby significantly enhancing the overall grinding ability and productivity while maintaining the simplicity of each individual layer's structure.

The patent uses a nested arrangement of grinding wheel layers where the second layer is positioned inside the first layer and the third layer inside the second layer. This nesting configuration maximizes the utilization of internal space, enabling the inner areas to actively participate in grinding operations and fully exert the grinding ability of the entire wheel structure.