Combined Laser Mechanical Machining Surface Absorptivity

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Solution Overview

Problem

Conventional machining methods face challenges in adjusting the absorptivity of a work surface for laser machining, leading to inefficient heating due to varying surface properties and the need for additional steps like blackening processing, which increases complexity and cost.

Innovation Solution

A combined machining method that performs mechanical machining to optimize the surface shape of the laser machining target region, adjusting the absorptivity by modifying the surface geometry to enhance or reduce the incidence angle and wave component absorption, allowing for efficient laser beam absorption and heating.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Use of energy by moving object

If blackening processing is applied to increase laser beam absorptivity, then heating efficiency is improved, but process complexity and cost increase due to additional steps

Engineering Contradiction:
Improvelaser beam absorptivityVSAvoidprocess complexity
Core Design Contradiction:
Use of energy by moving objectVSDevice complexity

Solution Approach 1:

The invention applies preliminary mechanical machining to the work surface before laser processing to create a surface shape with enhanced absorptivity. By forming grooves, ridges, or other geometric features through mechanical means, the surface naturally absorbs laser energy more effectively without requiring subsequent blackening or coating steps, thus eliminating process complexity while maintaining high heating efficiency

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The invention replaces the chemical/coating-based blackening process with a mechanical surface shaping process. Instead of applying absorbent materials to the surface, mechanical machining directly modifies the surface geometry to create light-trapping features that enhance laser absorption through physical structure rather than material composition

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Productivity

If energy density on work surface is increased for evaporation machining, then material removal efficiency is improved, but risk of excessive heating and surface damage increases

Engineering Contradiction:
Improvematerial removal efficiencyVSAvoidexcessive heating
Core Design Contradiction:
ProductivityVSObject-affected harmful factors

Solution Approach 1:

The invention creates localized surface features such as grooves, ridges, or patterns that concentrate laser energy precisely where material removal is needed. The modified surface geometry directs and concentrates laser beams into specific zones, enabling high energy density application only in targeted areas while leaving surrounding regions unaffected, thus achieving efficient material removal without excessive heating of the entire workpiece

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The invention transitions from uniform surface treatment to three-dimensional surface structuring. By creating depth variations, grooves, and relief features, the surface topology adds a dimensional element that controls laser energy distribution. This allows the laser to penetrate and concentrate energy in specific volumetric regions rather than distributing it uniformly across the surface, enabling precise material removal with controlled thermal effects

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Reliability

If mechanical machining is performed in two stages, then wafer splitting is prevented, but manufacturing time and process complexity increase

Engineering Contradiction:
Improvewafer integrityVSAvoidmanufacturing time
Core Design Contradiction:
ReliabilityVSLoss of time

Solution Approach 1:

The invention performs preliminary mechanical machining to create a surface shape with optimized laser absorptivity before laser processing. This pre-prepared surface geometry ensures that subsequent laser heating and material removal proceed efficiently in a single stage, eliminating the need for a second mechanical machining step while maintaining wafer integrity through controlled laser parameters and surface preparation

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables efficient heating of the work surface by optimizing absorptivity before laser machining, improving the heating process and allowing for precise temperature control while simplifying the machining process by eliminating the need for additional surface treatments.

Implementation Method 1

laser machining means for radiating a laser beam to a work and heating the work surface

Methodology Applied
Scientific EffectLaser heating: Heating

Implementation Method 2

the absorptivity of a laser beam tends to depend on the surface temperature of the work

Methodology Applied
Scientific EffectAbsorption of electromagnetic radiation: Absorption (EM radiation)

Implementation Method 3

mechanical machining means for performing mechanical machining with respect to a predetermined region on the work

Methodology Applied
Scientific EffectMechanical machining: Abrasion

Data Source

PatentUS10695871B2Combined machining method and computer readable medium
Publication Date: 2020.06.30 FANUC LTD
  • US10695871B2 patent drawing
  • US10695871B2 patent drawing
  • US10695871B2 patent drawing

AI summary

An absorptivity of a work is adjusted easily before laser machining is performed. A combined machining method performed by an apparatus including laser machining means and mechanical machining means includes a first step of performing mechanical machining with respect to a laser machining target region which is a target of laser machining on a machining target so that the laser machining target region has a surface shape having a predetermined absorptivity of a laser beam; and a second step of radiating a laser beam to the laser machining target region to heat the machining target after the first step ends.